# US 11,307,496 B2 · Metal brush layer for EUV patterning > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,307,496 B2 - Document ID: US11307496B2 - Status: Granted - Kind: B2 - Application number: 16/688,657 - Filed: 2019-11-19 - Published: 2021-05-20 - Granted: 2022-04-19 - Earliest claimed: 2019-11-19 - Assignees: International Business Machines Corporation - Applicants: International Business Machines Corporation - Inventors: Ekmini Anuja De Silva; Jing Guo; Jennifer Church; Dario Goldfarb - Web page: https://patentgrep.com/patent/US11307496B2 ## CPC - G03F 7/0042: {with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists (G03F7/075 takes precedence)} - G03F 7/091: {characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement} - G03F 7/11: having cover layers or intermediate layers, e.g. subbing layers {(G03F7/091 - G03F7/093, B41N3/03 take precedence)} - H10P 76/2041: {Photolithographic processes} - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A metal brush layer is provided. The metal brush layer includes a polymer backbone including at least one grafting unit, G, attached to the polymer backbone, and a plurality of metal-containing moieties, M, attached to the polymer backbone. ## Claims ### Claim 1 A metal brush layer, comprising: a polymer backbone including at least one grafting unit, G, attached to the polymer backbone; and a plurality of metal-containing moieties, M, attached to the polymer backbone. ### Claim 2 (depends on 1) The metal brush layer of claim 1, further comprising a plurality of adhesion promotors, A, attached to the polymer backbone. ### Claim 3 (depends on 1) The metal brush layer of claim 1, further comprising a plurality of photo-acid generating moieties, P, attached to the polymer backbone. ### Claim 4 (depends on 1) The metal brush layer of claim 1, further comprising a plurality of solubility switch moieties, S, attached to the polymer backbone. ### Claim 5 (depends on 1) The metal brush layer of claim 1, further comprising a plurality of adhesion promotors, A, attached to the polymer backbone, wherein the plurality of adhesion promotors, A, occur as a first block along the polymer backbone, and the plurality of metal-containing moieties, M, occur as a second block along the polymer backbone, such that the metal brush layer includes block copolymers. ### Claim 6 (depends on 5) The metal brush layer of claim 5, wherein the grafting unit, G, is a pendent group attached to a terminal monomer unit of the polymer backbone. ### Claim 7 (depends on 1) The metal brush layer of claim 1, further comprising a plurality of adhesion promoters, A, attached to the polymer backbone, wherein the plurality of adhesion promotors, A, and the plurality of metal-containing moieties, M, occur randomly along the polymer backbone, such that the metal brush layer includes random copolymers. ### Claim 8 (depends on 7) The metal brush layer of claim 7, wherein the grafting unit, G, is a pendent group attached to a terminal monomer unit of the polymer backbone. ### Claim 9 A metal brush layer, comprising: a polymer backbone including at least one grafting unit, G, attached to a terminal monomer of the polymer backbone; a plurality of metal-containing moieties, M, attached to the polymer backbone; and a plurality of first adhesion promoters, A1, attached to the polymer backbone, wherein the plurality of adhesion promotors, A, occur as a first block along the polymer backbone, and the plurality of metal-containing moieties, M, occur as a second block along the polymer backbone. ### Claim 10 (depends on 9) The metal brush layer of claim 9, further comprising a plurality of second adhesion promotors, A2, attached to the polymer backbone, wherein the plurality of second adhesion promotors, A2, occur as a third block along the polymer backbone. ### Claim 11 (depends on 9) The metal brush layer of claim 9, further comprising a plurality of photo-acid generating moieties, P, attached to the polymer backbone, wherein the plurality of photo-acid generating moieties, P, occur as a third block along the polymer backbone. ### Claim 12 (depends on 9) The metal brush layer of claim 9, further comprising a plurality of solubility switch moieties, S, attached to the polymer backbone, wherein the plurality of solubility switch moieties, S, occur as a third block along the polymer backbone. ### Claim 13 An EUV lithography stack, comprising: a metal brush layer on a substrate; and a resist layer on the metal brush layer, wherein the metal brush layer includes a polymer backbone including at least one grafting unit, G, attached to the polymer backbone, and a plurality of metal-containing moieties, M, attached to the polymer backbone. ### Claim 14 (depends on 13) The EUV lithography stack of claim 13, further comprising a hardmask layer between the metal brush layer and the substrate, wherein the metal brush layer is directly attached to the hardmask layer. ### Claim 15 (depends on 13) The EUV lithography stack of claim 13, further comprising a plurality of solubility switch moieties, S, attached to the polymer backbone. ### Claim 16 (depends on 15) The EUV lithography stack of claim 15, further comprising a plurality of photo-acid generating moieties, P, attached to the polymer backbone. ### Claim 17 (depends on 13) The EUV lithography stack of claim 13, further comprising a plurality of first adhesion promotors, A1, attached to the polymer backbone. ### Claim 18 (depends on 17) The EUV lithography stack of claim 17, further comprising a plurality of second adhesion promotors, A2, attached to the polymer backbone. ### Claim 19 (depends on 13) The EUV lithography stack of claim 13, wherein the resist is a polymeric material that is photo-sensitive to EUV light. ### Claim 20 (depends on 19) The EUV lithography stack of claim 19, wherein the substrate includes an organic planarization layer (OPL), and the metal brush layer is directly attached to the organic planarization layer.