# US 11,307,443 B2 · Electronic device having a curved surface and method for fabricating the same

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- Number: US 11,307,443 B2
- Document ID: US11307443B2
- Status: Granted
- Kind: B2
- Application number: 17/224,397
- Filed: 2021-04-07
- Published: 2021-11-04
- Granted: 2022-04-19
- Earliest claimed: 2020-04-30
- Assignees: Innolux Corporation
- Applicants: InnoLux Corporation
- Inventors: Fang-Cheng Jhou; Tsu-Hsien Ku
- Web page: https://patentgrep.com/patent/US11307443B2

## CPC

- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- G02F 1/133314: {Back frames}
- B32B 1/00: Layered products having a non-planar shape
- B32B 7/14: applied in spaced arrangements, e.g. in stripes
- B32B 9/005: {comprising one layer of ceramic material, e.g. porcelain, ceramic tile (layered products with at least two ceramic layers composed mainly of ceramic B32B18/00)}
- B32B 9/045: {of synthetic resin}
- B32B 17/06: comprising glass as the main or only constituent of a layer, next to another layer of a specific {material}
- B32B 27/08: of synthetic resin
- B32B 27/281: {comprising polyimides}
- B32B 27/32: comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)}
- B32B 27/36: comprising polyesters
- B32B 27/365: {comprising polycarbonates}
- C03C 27/10: with the aid of adhesive specially adapted for that purpose
- C04B 37/008: {by means of an interlayer consisting of an organic adhesive, e.g. phenol resin or pitch}
- C04B 37/047: {by means of an interlayer consisting of an organic adhesive, e.g. phenol resin or pitch}
- G02B 6/0055: {Reflecting element, sheet or layer}
- B32B 2270/00: Resin or rubber layer containing a blend of at least two different polymers
- B32B 2307/732: Dimensional properties
- B32B 2457/00: Electrical equipment
- B32B 2457/202: LCD, i.e. liquid crystal displays
- B32B 2457/208: Touch screens
- B32B 2605/00: Vehicles
- G02B 6/0088: {of the light guide or other optical sheets in the package}
- G02F 1/133305: {Flexible substrates, e.g. plastics, organic film}
- G02F 2201/50: Protective arrangements
- G02F 2202/28: Adhesive materials or arrangements
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C04B: LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE {(roofing granules E04D7/005)}; CERAMICS (devitrified glass-ceramics C03C10/00); REFRACTORIES; TREATMENT OF NATURAL STONE
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

## Abstract

An electronic device having a curved surface is provided. The electronic device having the curved surface includes a back frame having a curved surface, a panel having a curved surface disposed on the back frame having the curved surface, a protective substrate having a curved surface disposed on the panel having the curved surface, and a patterned adhesive element disposed on a portion of the back frame having the curved surface. The back frame having the curved surface and the protective substrate having the curved surface adhere to each other via the patterned adhesive element. The method for fabricating the electronic device having the curved surface is also provided.

## Claims

### Claim 1

An electronic device having a curved surface, comprising:
a back frame having a curved surface;
a panel having a curved surface disposed on the back frame having the curved surface;
a protective substrate having a curved surface disposed on the panel having the curved surface; and
a patterned adhesive element disposed on a portion of the back frame having the curved surface, wherein the back frame having the curved surface and the protective substrate having the curved surface directly adhere to each other via the patterned adhesive element.

### Claim 2 (depends on 1)

The electronic device having the curved surface as claimed in claim 1, wherein the back frame having the curved surface has a backboard and a housing disposed on a portion of the backboard, wherein the patterned adhesive element is disposed on a portion of the housing.

### Claim 3 (depends on 2)

The electronic device having the curved surface as claimed in claim 2, wherein the housing is disposed on at least a portion of edges of the backboard.

### Claim 4 (depends on 2)

The electronic device having the curved surface as claimed in claim 2, wherein the backboard and the housing are integrally formed.

### Claim 5 (depends on 2)

The electronic device having the curved surface as claimed in claim 2, wherein the housing has a stepped shape in a cross-sectional view.

### Claim 6 (depends on 1)

The electronic device having the curved surface as claimed in claim 1, wherein the patterned adhesive element comprises a double-sided tape, a light curing adhesive, or a light blocking adhesive.

### Claim 7 (depends on 1)

The electronic device having the curved surface as claimed in claim 1, wherein the patterned adhesive element and the panel having the curved surface do not adhere to each other, and the panel having the curved surface adheres to the protective substrate having the curved surface through an optical adhesive.

### Claim 8 (depends on 1)

The electronic device having the curved surface as claimed in claim 1, further comprising a backlight source disposed between the back frame having the curved surface and the panel having the curved surface, wherein the patterned adhesive element does not overlap the backlight source.

### Claim 9 (depends on 8)

The electronic device having the curved surface as claimed in claim 8, further comprising a circuit board disposed between the back frame having the curved surface and the backlight source, wherein the backlight source is electrically connected to the circuit board.

### Claim 10 (depends on 9)

The electronic device having the curved surface as claimed in claim 9, further comprising a light guide plate and a reflector disposed adjacent to the backlight source and the circuit board.

### Claim 11 (depends on 1)

The electronic device having the curved surface as claimed in claim 1, wherein the protective substrate having the curved surface protrudes from or is aligned with the back frame having the curved surface.

### Claim 12 (depends on 1)

The electronic device having the curved surface as claimed in claim 1, wherein the protective substrate having the curved surface is recessed from an edge of the back frame having the curved surface.

### Claim 13 (depends on 1)

The electronic device having the curved surface as claimed in claim 1, wherein the protective substrate has a plurality of substrates, wherein any two adjacent substrates adhere to each other via an adhesive layer.

### Claim 14 (depends on 1)

The electronic device having the curved surface as claimed in claim 1, further comprising another panel having a curved surface disposed on the back frame having the curved surface, wherein the protective substrate having the curved surface corresponds to the panel and the other panel.

### Claim 15 (depends on 1)

The electronic device having the curved surface as claimed in claim 1, wherein a radius of curvature of the electronic device is greater than or equal to 1000 mm and is less than 3000 mm.

### Claim 16

A method for fabricating an electronic device having a curved surface, comprising:
adhering a panel to a protective substrate using an optical adhesive to form a composite panel;
providing a back frame having a curved surface, and disposing a patterned adhesive element on a portion of the back frame having the curved surface; and
adhering the composite panel to the back frame having the curved surface via the patterned adhesive element by performing a cold bending process to form the electronic device having the curved surface.

### Claim 17 (depends on 16)

The method for fabricating the electronic device having the curved surface as claimed in claim 16, wherein the cold bending process is performed at a temperature between 10° C. and 60° C.

### Claim 18 (depends on 16)

The method for fabricating the electronic device having the curved surface as claimed in claim 16, wherein the protective substrate has a plurality of substrates, wherein any two adjacent substrates adhere to each other via an adhesive layer.

### Claim 19 (depends on 16)

The method for fabricating the electronic device having the curved surface as claimed in claim 16, wherein the composite panel has a flat surface before the step of adhering the composite panel to the back frame, and has a curved surface after the step of adhering the composite panel to the back frame.

### Claim 20 (depends on 16)

The method for fabricating the electronic device having the curved surface as claimed in claim 16, wherein a radius of curvature of the composite panel is greater than or equal to 3000 mm before the step of adhering the composite panel to the back frame, and a radius of curvature of the composite panel is less than 3000 mm after the step of adhering the composite panel to the back frame.
