# US 11,307,247 B2 · Prober with busbar mechanism for testing a device under test > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,307,247 B2 - Document ID: US11307247B2 - Status: Granted - Kind: B2 - Application number: 16/778,708 - Filed: 2020-01-31 - Published: 2020-08-06 - Granted: 2022-04-19 - Earliest claimed: 2019-01-31 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Andreas Gneupel - Web page: https://patentgrep.com/patent/US11307247B2 ## CPC - G01R 31/2889: {Interfaces, e.g. between probe and tester (G01R31/31905 and G01R1/07364 take precedence)} - G01R 1/0466: {concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding} - G01R 31/2887: {involving moving the probe head or the IC under test; docking stations (moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392)} - G01R 31/2896: {Testing of IC packages; Test features related to IC packages (containers per se H10W76/10, encapsulations per se H10W74/00)} - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract Prober for a test system for testing a device under test is disclosed. In one example, the prober comprises a busbar mechanism for transporting electric signals to and away from the device under test. ## Claims ### Claim 1 A prober for a test system for testing a device under test, wherein the prober comprises: a busbar mechanism for transporting electric signals to and/or away from the device under test, wherein the busbar mechanism comprises: an at least partially electrically conductive first busbar plate for conducting an electric signal to and/or away from the device under test; and an at least partially electrically conductive second busbar plate for conducting the electric signal to and/or away from the device under test. ### Claim 2 (depends on 1) The prober according to claim 1, wherein the busbar mechanism is configured as a movable busbar mechanism. ### Claim 3 (depends on 1) The prober according to claim 1, configured as a wafer prober for testing chips on a wafer as device under test. ### Claim 4 (depends on 1) The prober according to claim 1, comprising electrically conductive contact elements for applying an electric stimulus signal to at least one side of the device under test and for detecting an electric response signal in response to the applied electric stimulus signal on at least one side of the device under test. ### Claim 5 (depends on 1) The prober according to claim 1, wherein the first busbar plate is a bottom side busbar plate, and the second busbar plate is a top side busbar plate. ### Claim 6 (depends on 1) The prober according to claim 1, wherein the first busbar plate is a movable busbar plate. ### Claim 7 (depends on 1) The prober according to claim 1, wherein the second busbar plate is a spatially fixed busbar plate. ### Claim 8 (depends on 1) The prober according to claim 1, wherein the second busbar plate has a larger surface area than the first busbar plate. ### Claim 9 (depends on 1) The prober according to claim 1, comprising a contact mechanism configured for selectively establishing or disabling an electric contact between the first busbar plate and the second busbar plate. ### Claim 10 (depends on 9) The prober according to claim 9, wherein the contact mechanism comprises an electrically conductive bar on the second busbar plate. ### Claim 11 (depends on 9) The prober according to claim 9, wherein the contact mechanism establishes an electric contact between the first busbar plate and the second busbar plate when the device under test is contacted by contact elements, and disables an electric contact between the first busbar plate and the second busbar plate while moving the first busbar plate and the second busbar plate relatively to one another, in particular in a horizontal plane. ### Claim 12 (depends on 1) The prober according to claim 1, comprising a chuck connected to the first busbar plate and configured for carrying the device under test. ### Claim 13 (depends on 12) The prober according to claim 12, wherein the chuck comprises electrically conductive contact elements connected to the first busbar plate and configured for contacting the device under test from a bottom side. ### Claim 14 (depends on 1) The prober according to claim 1, comprising a needle card comprising electrically conductive contact elements configured for contacting the device under test from a top side. ### Claim 15 (depends on 1) The prober according to claim 1, comprising one of the following features: comprising a first contact ring comprising multiple electric contacts, including multiple spring-loaded pins, connected with the second busbar plate and connectable with the first busbar plate and/or comprising a second contact ring comprising multiple electric contacts, in particular multiple further spring-loaded pins, connected to a needle card; and comprising a first contact plate, configured as a vertical plate, connected with the second busbar plate and connectable with the first busbar plate and/or comprising a second contact plate, in particular configured as a further vertical plate, connected to a needle card. ### Claim 16 (depends on 1) A test system for testing a device under test, wherein the test system comprises: a prober according to claim 1; and an electric test unit coupled with the prober for supplying electric stimulus signals to the prober and for analyzing electric response signals from the prober. ### Claim 17 (depends on 1) A method of testing a device under test, wherein the method comprises conducting an electric signal to and/or from the device under test by a prober according to claim 1, via a first busbar plate, a contact mechanism including the electrically conductive bar, and a second busbar plate. ### Claim 18 (depends on 17) The method according to claim 17, comprising at least one of the following features: wherein the method comprises testing chips on a wafer as the device under test, in particular chips on a wafer having a diameter of at least 200 mm, more particularly of at least 300 mm; wherein the method comprises testing, as the device under test, a wafer comprising a plurality of power semiconductor chips; wherein the method comprises testing, as the device under test, a wafer comprising a plurality of semiconductor chips having a vertical current flow between two opposing main surfaces; wherein the method comprises testing the device under test using non-constant signals or fast-changing signals. ### Claim 19 (depends on 1) A method which comprises retrofitting an existing wafer prober for a test system so that the retrofitted prober is configured for testing wafers with a busbar mechanism, in particular for retrofitting the existing wafer prober for providing a prober according to claim 1.