# US 11,307,223 B2 · Inspection device and method of controlling temperature of probe card

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- Number: US 11,307,223 B2
- Document ID: US11307223B2
- Status: Granted
- Kind: B2
- Application number: 16/842,561
- Filed: 2020-04-07
- Published: 2020-10-29
- Granted: 2022-04-19
- Earliest claimed: 2019-04-25
- Assignees: Tokyo Electron Limited
- Applicants: Tokyo Electron Limited
- Inventors: Jun Fujihara; Jun Mochizuki
- Web page: https://patentgrep.com/patent/US11307223B2

## CPC

- G01R 1/44: Modifications of instruments for temperature compensation
- G01R 31/2891: {related to sensing or controlling of force, position, temperature (G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05)}
- G01R 1/07342: {the body of the probe being at an angle other than perpendicular to test object, e.g. probe card}
- G01R 31/2831: {Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates (G01R31/318511 takes precedence; testing during manufacture H10P74/00)}
- G01R 31/2874: {related to temperature}
- G01R 1/07314: {the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support (on an elastic support, e.g. a film, G01R1/0735)}
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)

## Abstract

An inspection device for inspecting an inspection target substrate includes a probe card, a tester, a plurality of conductive lines, and a resistor. The probe card has probes to be in contact with the inspection target substrate. The tester is configured to transmit and receive electric signals for an inspection to and from the inspection target substrate through the probes. The conductive lines electrically connect the probe card with the tester, and at least a part of the conductive lines is electrically connected to the probes. The resistor is formed at the probe card and serves as an electrical resistor. The tester is further configured to measure a resistance of the resistor based on the electric signals transmitted and received through the conductive lines.

## Claims

### Claim 1

An inspection device for inspecting an inspection target substrate, comprising:
a probe card having probes to be in contact with the inspection target substrate;
a tester configured to transmit and receive electric signals for an inspection to and from the inspection target substrate through the probes;
a plurality of conductive lines that electrically connect the probe card with the tester, at least a part of the conductive lines being electrically connected to the probes; and
a resistor configured to short-circuit a pair of the conductive lines and serve as an electrical resistor,
wherein the tester is further configured to measure a resistance of the resistor between the pair of the conductive lines before the inspection is performed.

### Claim 2 (depends on 1)

The inspection device of claim 1, wherein the tester is further configured to determine whether or not the probes are positionally stable based on a measurement result of the resistance.

### Claim 3 (depends on 1)

The inspection device of claim 1, wherein the tester is further configured to estimate a temperature of the probe card based on a measurement result of the resistance.

### Claim 4 (depends on 1)

The inspection device of claim 1, wherein the resistor is formed on at least one of the probe side of the probe card, the tester side of the probe card, or inside the probe card.

### Claim 5 (depends on 1)

The inspection device of claim 1, wherein the probe card is divided into a plurality of areas and the resistor is disposed in each of the divided areas of the probe card.

### Claim 6 (depends on 1)

The inspection device of claim 1, wherein the resistor is a short-circuit line configured to short-circuit the pair of the conductive lines and the short-circuit line has a linear and thin film shape.

### Claim 7 (depends on 6)

The inspection device of claim 6, wherein a length of the short-circuit line is greater than a distance between ends of the pair of the conductive lines on the probe card side.

### Claim 8 (depends on 7)

The inspection device of claim 7, wherein the short-circuit line is repeatedly extended and folded in a radial direction of the probe card.

### Claim 9 (depends on 1)

The inspection device of claim 1, wherein the tester is further configured to predict a state of a member disposed around the probe card based on a measurement result of the resistance.

### Claim 10 (depends on 9)

The inspection device of claim 9, wherein the tester is further configured to control the member based on the predicted state of the member.

### Claim 11

A method of controlling a temperature of a probe card provided in an inspection device for inspecting an inspection target substrate before an inspection is performed,
wherein the inspection device includes:
a tester configured to transmit and receive electric signals for the inspection to and from the inspection target substrate through probes of the probe card;
a plurality of conductive lines that electrically connect the probe card with the tester, at least a part of the conductive lines being electrically connected to the probes; and
a resistor configured to short-circuit a pair of the conductive lines and serves as an electrical resistor,
the method comprising:
heating or cooling the probe card;
measuring a resistance of the resistor between the pair of the conductive lines; and
determining whether or not a temperature of the probe card is stable based on a measurement result of the resistance.
