# US 11,307,185 B2 · Air-quality detection apparatus

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- Number: US 11,307,185 B2
- Document ID: US11307185B2
- Status: Granted
- Kind: B2
- Application number: 16/705,762
- Filed: 2019-12-06
- Published: 2020-06-11
- Granted: 2022-04-19
- Earliest claimed: 2018-12-07
- Assignees: LG Electronics Inc.
- Applicants: LG Electronics Inc.
- Inventors: Chiwan Park; Kijung Sung; Hyunho Oh; Taedong Shin
- Web page: https://patentgrep.com/patent/US11307185B2

## CPC

- G01N 33/0031: {comprising two or more sensors, e.g. a sensor array}
- G01N 33/0032: {using two or more different physical functioning modes}
- G01N 15/06: Investigating concentration of particle suspensions (by weighing G01N5/00; investigating sedimentation of particle suspensions G01N15/04; investigating individual particles G01N15/10)
- G01N 33/004: {CO or CO2}
- G01N 33/0047: {Organic compounds}
- H05K 1/144: {Stacked arrangements of planar printed circuit boards}
- H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence)
- G01N 15/075: by optical means
- G01N 2015/0046: {in gas, e.g. smoke}
- H05K 2201/10151: Sensor
- Y02A 50/20: Air quality improvement or preservation, e.g. vehicle emission control or emission reduction by using catalytic converters
- G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02A: TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE

## Abstract

Disclosed is an air-quality detection apparatus including a casing body including a bottom and a side wall, a first printed circuit board (PCB) disposed horizontally above the bottom, a second PCB disposed horizontally in a first region above the first PCB, a CO2 sensor mounted on the second PCB, a volatile organic compound (VOC) sensor mounted in a second region on the first PCB that is closer to the side wall than the first region, a third PCB, which is disposed horizontally at a position spaced further upwards apart from the bottom than the first PCB and at least a portion of which is disposed in a third region that does not overlap the first PCB when the bottom is viewed from above, a fourth PCB disposed horizontally above the second PCB and the third PCB, and a dust sensor mounted on the fourth PCB.

## Claims

### Claim 1

An air-quality detection apparatus, comprising:
a casing body comprising a bottom and a side wall extending upwards from a circumference of the bottom;
a first printed circuit board (PCB) disposed horizontally above the bottom;
a second PCB disposed horizontally in a first region above the first PCB;
a CO2 sensor mounted on the second PCB;
a volatile organic compound (VOC) sensor mounted in a second region on a top surface of the first PCB, the second region being closer to the side wall than the first region;
a third PCB on which a wireless communication interface is mounted, the third PCB being disposed horizontally at a position spaced further upwards apart from the bottom than the first PCB, at least a portion of the third PCB being disposed in a third region that does not overlap the first PCB when the bottom is viewed from above;
a fourth PCB disposed horizontally above the second PCB and the third PCB; and
a dust sensor mounted on a top surface of the fourth PCB.

### Claim 2 (depends on 1)

The air-quality detection apparatus according to claim 1, wherein the CO2 sensor is mounted on a bottom surface of the second PCB.

### Claim 3 (depends on 2)

The air-quality detection apparatus according to claim 2, wherein the CO2 sensor is spaced 2.8 mm or more apart from the first PCB.

### Claim 4 (depends on 1)

The air-quality detection apparatus according to claim 1, wherein, when the bottom is viewed from above, the fourth PCB overlaps the CO2 sensor and the VOC sensor.

### Claim 5 (depends on 1)

The air-quality detection apparatus according to claim 1, wherein, when the bottom is viewed from above, at least a portion of the third PCB overlaps the fourth PCB.

### Claim 6 (depends on 1)

The air-quality detection apparatus according to claim 1, wherein at least a portion of the CO2 sensor is disposed in an interval corresponding to a difference in height between the third PCB and the first PCB.

### Claim 7 (depends on 6)

The air-quality detection apparatus according to claim 6, wherein the CO2 sensor comprises a portion occupying a region above the third PCB.

### Claim 8 (depends on 1)

The air-quality detection apparatus according to claim 1, wherein the wireless communication interface is mounted on a bottom surface of the third PCB.

### Claim 9 (depends on 1)

The air-quality detection apparatus according to claim 1, further comprising:
a mount boss protruding from the bottom,
wherein the first PCB comprises a first through-hole formed therein to allow the mount boss to pass therethrough,
wherein the fourth PCB comprises a second through-hole formed at a position corresponding to a position of the first through-hole, and
wherein the air-quality detection apparatus further comprises a screw configured to pass through the second through-hole from above and to be fastened to the mount boss.

### Claim 10 (depends on 9)

The air-quality detection apparatus according to claim 9, wherein the fourth PCB comprises a first side and a second side intersecting the first side, and
wherein the air-quality detection apparatus further comprises a retaining rib protruding from the bottom to surround the first side and the second side of the fourth PCB.

### Claim 11 (depends on 1)

The air-quality detection apparatus according to claim 1, further comprising:
a temperature/humidity sensor mounted on a bottom surface of the first PCB.

### Claim 12 (depends on 1)

The air-quality detection apparatus according to claim 1, further comprising:
a processor configured to transmit a detection value of at least one of the CO2 sensor, the VOC sensor, or the dust sensor to a communication network through the wireless communication interface.
