# US 11,307,125 B2 · MEMS nanoindenter chip with indenter probe and reference probe

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- Number: US 11,307,125 B2
- Document ID: US11307125B2
- Status: Granted
- Kind: B2
- Application number: 16/196,145
- Filed: 2018-11-20
- Published: 2019-05-23
- Granted: 2022-04-19
- Earliest claimed: 2017-11-22
- Assignees: Femtotools AG
- Applicants: Femtotools AG
- Inventors: David Beyeler; Simon Muntwyler; Felix Beyeler
- Web page: https://patentgrep.com/patent/US11307125B2

## CPC

- G01N 3/42: by performing impressions under a steady load by indentors, e.g. sphere, pyramid (G01N3/54 takes precedence)
- G01Q 60/366: {Nanoindenters, i.e. wherein the indenting force is measured}
- G01N 2203/0051: Piezoelectric means
- G01N 2203/0286: Miniature specimen; Testing on microregions of a specimen
- G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q)
- G01Q: SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]

## Abstract

A MEMS-nanoindenter chip performs nanoindentation on a specimen. The MEMS-nanoindenter chip has an intender probe joined with an indenter tip. The indenter tip indents into the specimen. A reference probe is joined with a reference tip, the reference tip touches the specimen. Sensing capabilities are provided to measure the position of the indenter probe relative to the reference probe. The MEMS-nanoindenter chip enables highly accurate measurements since the frame stiffness is not part of the measurement chain any more. Furthermore, thermal drift during the nanoindentation is considerably reduced.

## Claims

### Claim 1

A micro-electro-mechanical systems (MEMS)-nanoindenter chip for performing nanoindentation on a specimen, the MEMS-nanoindenter chip comprising:
an indenter probe;
an indenter tip joined to said indenter probe, said indenter tip provided for indenting into the specimen;
a reference probe having a u-shaped structure and reduction flexures for increasing a range of position sensing, said reduction flexures being disposed in said u-shaped structure;
a reference tip joined to said reference probe by said reduction flexures, said reference tip provided for touching the specimen; and
a sensor for measuring a position of said indenter probe relative to said reference probe.

### Claim 2 (depends on 1)

The MEMS-nanoindenter chip according claim 1, further comprising an adapter piece for mounting said indenter tip to said indenter probe.

### Claim 3 (depends on 1)

The MEMS-nanoindenter chip according to claim 1, wherein said reference tip has a flat or rounded shape.

### Claim 4 (depends on 1)

The MEMS-nanoindenter chip according to claim 1, wherein said indenter tip is mounted on said indenter probe a few micrometers behind said reference tip of said reference probe such that said reference tip gets in contact with the specimen prior to said indenter tip.

### Claim 5 (depends on 1)

The MEMS-nanoindenter chip according to claim 1, wherein said reference tip has a sphere being assembled onto said reference probe.

### Claim 6 (depends on 1)

The MEMS-nanoindenter chip according to claim 1, further comprising indenter flexures suspending said indenter probe allowing a movement along an axis of said indenter probe.

### Claim 7 (depends on 6)

The MEMS-nanoindenter chip according to claim 6, further comprising indenter reference flexures suspending said reference probe allowing a movement along an axis of said reference probe.

### Claim 8 (depends on 7)

The MEMS-nanoindenter chip according to claim 7, wherein said indenter flexures are stiffer than said reference flexures.

### Claim 9 (depends on 1)

The MEMS-nanoindenter chip according to claim 1, wherein:
said sensor has interface electronics; and
said sensor for measuring the position of said indenter probe relative to said reference probe, has indenter electrodes forming a capacitor, wherein a change of a relative position causes a change of capacitance of said capacitor which is measured by said interface electronics.

### Claim 10 (depends on 1)

The MEMS-nanoindenter chip according to claim 1, wherein:
said sensor has interface electronics; and
said sensor for measuring the position of said indenter probe relative to said reference probe has indenter electrodes forming a first capacitor and reference electrodes forming a second capacitor, where a change of a relative position causes a change of capacitance of said first and second capacitors which is measured by said interface electronics.

### Claim 11 (depends on 10)

The MEMS-nanoindenter chip according to claim 10, wherein said indenter electrodes and said reference electrodes of said first and second capacitors are disposed transverse.

### Claim 12 (depends on 10)

The MEMS-nanoindenter chip according to claim 10, wherein said indenter electrodes and said reference electrodes of said first and second capacitors are disposed parallel.

### Claim 13 (depends on 10)

The MEMS-nanoindenter chip according to claim 10, wherein at least one of said indenter electrodes or said reference electrodes form a differential capacitive comb drive.