# US 11,307,110 B2 · Pressure-sensor assembly having a carrier substrate

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- Number: US 11,307,110 B2
- Document ID: US11307110B2
- Status: Granted
- Kind: B2
- Application number: 16/717,282
- Filed: 2019-12-17
- Published: 2020-06-25
- Granted: 2022-04-19
- Earliest claimed: 2018-12-21
- Assignees: Robert Bosch GmbH
- Applicants: Robert Bosch GmbH
- Inventors: Alexander Lux; Christian Hauer
- Web page: https://patentgrep.com/patent/US11307110B2

## CPC

- G01L 19/0627: {Protection against aggressive medium in general}
- H10W 72/50: Bond wires
- G01L 9/0042: {Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms (details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively)}
- G01L 19/0069: {from the sensor to its support}
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/68: Shapes or dispositions thereof
- H10W 70/695: Organic materials
- H10W 76/47: Solid or gel fillings
- H10W 72/01515: {Forming coatings}
- H10W 72/075: {of bond wires}
- H10W 72/354: {comprising polymers}
- H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 76/12: characterised by their shape
- H10W 76/167: {the container walls comprising an aperture, e.g. for pressure control}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

For a pressure-sensor assembly, including a carrier substrate having conductor tracks disposed on a first side of the carrier substrate, a pressure-sensor element that is mounted on the first side of the carrier substrate and is electrically contacted via a bonding-wire connection to a conductor track located on the first side of the carrier substrate, as well as a frame part having a full-perimeter frame wall, the frame part being positioned on the first side of the carrier substrate around the pressure-sensor element, and the frame part being filled with a gel covering the pressure-sensor element, it is provided that in addition to the full-perimeter frame wall, the frame part has a base which is positioned on at least one conductor track disposed on the first side of the carrier substrate.

## Claims

### Claim 1

A pressure-sensor assembly, comprising:
a carrier substrate having conductor tracks disposed on a first side of the carrier substrate;
a pressure-sensor element mounted on the first side of the carrier substrate and electrically contacted via a bonding-wire connection to at least one conductor track of the conductor tracks disposed on the first side of the carrier substrate;
a frame part having a full-perimeter frame wall, the frame part being positioned on the first side of the carrier substrate around the pressure-sensor element, the frame part being filled with a gel covering the pressure-sensor element;
wherein, in addition to the full-perimeter frame wall, the frame part has a base which is positioned on the at least one conductor track of the conductor tracks disposed on the first side of the carrier substrate, wherein a surface of the base extends above the at least one conductor track and below the pressure-sensor element and is at least partially between the at least one conductor track of the conductor tracks and the pressure-sensor element in a plane perpendicular to an extension of a surface of the at least one conductor track,
wherein a bottom side of the base pointing toward the carrier substrate is adhered onto the at least one conductor track using an adhesive layer, wherein the adhesive layer is applied between the base and the at least one conductor track.

### Claim 2 (depends on 1)

The pressure-sensor assembly as recited in claim 1, wherein the pressure-sensor element is mounted on an inner side of the base pointing away from the carrier substrate.

### Claim 3 (depends on 2)

The pressure-sensor assembly as recited in claim 2, wherein the pressure-sensor element is adhered onto the inner side of the base pointing away from the carrier substrate.

### Claim 4 (depends on 1)

The pressure-sensor assembly as recited in claim 1, wherein the base has at least one contacting opening, and at least one section of the at least one conductor track within the contacting opening is not covered by the base.

### Claim 5 (depends on 4)

The pressure-sensor assembly as recited in claim 4, wherein the bonding-wire connection is electrically contacted through the contacting opening to the section of the conductor track not covered in the contacting opening, the bonding-wire connection being bonded at one end to the pressure-sensor element and with its other end onto the section within the contacting opening.

### Claim 6 (depends on 5)

The pressure-sensor assembly as recited in claim 5, wherein the section of the conductor track within the contacting opening not covered by the base is covered by a passivation layer surrounding the other end of the bonding-wire connection.

### Claim 7 (depends on 6)

The pressure-sensor assembly as recited in claim 6, wherein the gel within the frame part covers the passivation layer.

### Claim 8 (depends on 1)

The pressure-sensor assembly as recited in claim 1, wherein the carrier substrate is a printed circuit board made of glass-fiber-reinforced epoxy resin.

### Claim 9 (depends on 1)

The pressure-sensor assembly as recited in claim 1, wherein the frame part having the frame wall and the base is formed in one piece from plastic or metal.