# US 11,306,980 B2 · Heat sink and thermal dissipation system

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- Number: US 11,306,980 B2
- Document ID: US11306980B2
- Status: Granted
- Kind: B2
- Application number: 17/030,403
- Filed: 2020-09-24
- Published: 2022-03-10
- Granted: 2022-04-19
- Earliest claimed: 2020-09-08
- Assignees: Inventec (Pudong) Technology Corporation; Inventec Corporation
- Applicants: Inventec (Pudong) Technology Corporation; Inventec Corporation
- Inventors: Kai-Yang Tung; Hung-Ju Chen
- Web page: https://patentgrep.com/patent/US11306980B2

## CPC

- F28D 15/0233: {the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence)}
- F28F 3/025: {the means being corrugated, plate-like elements}
- F28D 15/046: {characterised by the material or the construction of the capillary structure}
- F28F 3/12: Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)}
- F28F 13/003: {by using permeable mass, perforated or porous materials (F28F13/18 takes precedence)}
- F28F 21/085: {from copper or copper alloys}
- F28D 2021/0029: {Heat sinks}
- F28F 2215/10: Secondary fins, e.g. projections or recesses on main fins
- F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general)
- F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16)

## Abstract

A heat sink includes a bottom plate, a liquid barrier structure and a microstructure used for heat dissipation. The liquid barrier wall is arranged on the bottom plate. The liquid barrier wall is closed on the bottom plate to form a container. The microstructure for heat dissipation is arranged in the container and includes porous materials or 3D-structures with small sizes.

## Claims

### Claim 1

A heat sink used for a droplet-cooling type heat dissipation system, comprising:
a bottom plate;
a liquid barrier wall disposed upon and surrounding the bottom plate to form a container;
a porous structure filled in the container formed by the liquid barrier wall;
a locking structure disposed on the bottom plate and within the container;
an isolation wall disposed on the bottom plate; and
a plurality of heat conducting fins disposed in the container, wherein a plurality of microstructures are disposed on the bottom plate and the heat conducting fins and the microstructures are raised on recessed from the heat conducting fins and the bottom plate,
wherein the locking structure is adjacent to a periphery of the container, the isolation wall is connected to the liquid barrier wall to form a closed chamber, and the locking structure is disposed in the closed chamber.

### Claim 2 (depends on 1)

The heat sink of claim 1,
wherein the isolation wall is disposed between the locking structure and the porous structure.

### Claim 3 (depends on 1)

The heat sink of claim 1, wherein the porous structure is a copper powder sintered metal.

### Claim 4

A thermal dissipation system, comprising:
a heat sink being disposed on a heat source, wherein the heat sink comprises:
a bottom plate;
a liquid barrier wall disposed upon and surrounding the bottom plate to form a container;
a porous structure filled in the container formed by the liquid barrier wall;
a locking structure disposed on the bottom plate and within the container;
an isolation wall disposed on the bottom plate; and
a plurality of heat conducting fins disposed in the container, wherein a plurality of microstructures are disposed on the bottom plate and the heat conducting fins and the microstructures are raised on recessed from the heat conducting fins and the bottom plate, wherein the locking structure is adjacent to a periphery of the container, the isolation wall is connected to the liquid barrier wall to form a closed chamber, and the locking structure is disposed in the closed chamber; and
a coolant source disposed above the heat sink, wherein the coolant source is configured to drip coolant toward the container of the heat sink,
wherein the coolant source drips the coolant toward the heat sink, the coolant receives the heat conducted by the heat sink and has a phase changing to dissipate the heat, thereby exerting a heat dissipation effect.

### Claim 5 (depends on 1)

The heat sink of claim 1, wherein the heat conducting fins comprise a plurality of columnar heat conducting fins, and a projection of each of columnar heat conducting fins on the bottom plate is a circle.

### Claim 6 (depends on 5)

The heat sink of claim 5, wherein the columnar heat conducting fins are disposed on a plurality of straight rows in the liquid barrier wall, the straight rows extend in a first direction, and the straight rows are disposed in a second direction.

### Claim 7 (depends on 6)

The heat sink of claim 6, wherein the straight rows comprise a first straight row and a second straight row, the first and second straight rows are two immediately-adjacent ones of the straight rows, a plurality of first columnar heat conducting fins of columnar heat conducting fins is disposed in the first straight row, a plurality of second columnar heat conducting fins of the columnar heat conducting fins is disposed in the second straight row, and any one of the first columnar heat conducting fins is not aligned with any of the second columnar heat conducting fins in the second direction.