# US 11,306,398 B2 · Method of forming circuit body and circuit body

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- Number: US 11,306,398 B2
- Document ID: US11306398B2
- Status: Granted
- Kind: B2
- Application number: 16/413,925
- Filed: 2019-05-16
- Published: 2019-09-05
- Granted: 2022-04-19
- Earliest claimed: 2016-11-18
- Assignees: Yazaki Corporation
- Applicants: Yazaki Corporation
- Inventors: Keita Shimakura; Takuo Matsumoto
- Web page: https://patentgrep.com/patent/US11306398B2

## CPC

- C23C 24/04: Impact or kinetic deposition of particles
- B60R 16/0207: {Wire harnesses}
- H01B 13/00: Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B 13/01209: {Details}
- H01B 13/165: {by spraying}
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- B60R: VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})

## Abstract

A conductive portion of a circuit body is formed by performing spraying on a surface of a resin casing. For spraying of the conductive portion, a cold spray method in which metal powder and inert gas are sprayed to an object is used. A circuit component is mounted on the conductive portion. Each terminal portion of the conductive portion is provided with a connector for connection with an external circuit body. An insulating resin is laminated on a surface of the conductive portion. The circuit body is directly formed on the surface of the resin casing by a series of processes described above.

## Claims

### Claim 1

A circuit body, comprising:
a resin casing; and
a conductive portion which is formed on a surface of the resin casing, wherein
the conductive portion has
a first layer constituted of an aggregate of metal particles and embedded in the surface of the resin casing, and
a second layer constituted of an aggregate of metal particles and laminated on the first layer,
a density of the second layer is greater than that of the first layer, wherein
the conductive portion in which a particle diameter of the metal particles is 5 μm or more and 50 μm or less is formed in the resin casing mounted on a vehicle,
an insulating resin is laminated at least on the conductive portion, and
a circuit component is mounted on the conductive portion,
wherein the circuit component has
a connector unit to which a wire connected to an auxiliary device is connected, and
a control unit for controlling the auxiliary device.

### Claim 2 (depends on 1)

The circuit body according to claim 1, further comprising:
a terminal portion which is electrically connected to an external circuit body provided on an object to which the resin casing is assembled.

### Claim 3 (depends on 1)

The circuit body according to claim 1, further comprising:
a wire wired on the resin casing, wherein
one end of the wire is electrically connected to the circuit component.

### Claim 4 (depends on 3)

The circuit body according to claim 3, wherein
the wire is a signal circuit for transmitting a signal.