# US 11,306,239 B2 · High thermal conductivity prepreg and uses of the same

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- Number: US 11,306,239 B2
- Document ID: US11306239B2
- Status: Granted
- Kind: B2
- Application number: 16/359,825
- Filed: 2019-03-20
- Published: 2020-06-04
- Granted: 2022-04-19
- Earliest claimed: 2018-11-30
- Assignees: Taiwan Union Technology Corporation
- Applicants: Taiwan Union Technology Corporation
- Inventors: Chih-Wei Liao; Chen-Hua Yu
- Web page: https://patentgrep.com/patent/US11306239B2

## CPC

- C09K 5/14: Solid materials, e.g. powdery or granular
- B32B 5/022: {Non-woven fabric}
- B32B 5/024: {Woven fabric}
- B32B 5/028: {Net structure, e.g. spaced apart filaments bonded at the crossing points}
- B32B 5/26: another layer {next to it} also being fibrous or filamentary {(relative arrangement of fibres or filaments of different layers B32B5/12)}
- B32B 7/06: permitting easy separation
- B32B 15/092: comprising epoxy resins
- B32B 15/12: of paper or cardboard
- B32B 15/14: next to a fibrous or filamentary layer
- B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)}
- B32B 29/005: {next to another layer of paper or cardboard layer}
- B32B 29/02: next to a fibrous or filamentary layer
- C08J 5/08: glass fibres
- C08J 5/244: {using glass fibres}
- C08J 5/249: {characterised by the additives used in the prepolymer mixture}
- H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)}
- H05K 1/0366: {reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence)}
- H05K 3/022: {Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates}
- B32B 2250/40: Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
- B32B 2255/02: on fibrous or filamentary layer
- B32B 2255/12: on paper layer
- B32B 2260/021: Fibrous or filamentary layer
- B32B 2260/028: Paper layer
- B32B 2260/046: Synthetic resin
- B32B 2262/0253: Polyolefin fibres
- B32B 2262/0261: Polyamide fibres
- B32B 2262/10: Inorganic fibres
- B32B 2262/101: Glass fibres
- B32B 2262/106: Carbon fibres, e.g. graphite fibres
- B32B 2262/14: Mixture of at least two fibres made of different materials
- B32B 2264/0257: Polyolefin particles, e.g. polyethylene or polypropylene homopolymers or ethylene-propylene copolymers
- B32B 2264/10: Inorganic particles
- B32B 2264/101: Glass
- B32B 2264/102: Oxide or hydroxide
- B32B 2264/104: Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
- B32B 2264/107: Ceramic
- B32B 2264/108: Carbon, e.g. graphite particles
- B32B 2307/204: Di-electric
- B32B 2307/302: Conductive
- B32B 2307/3065: Flame resistant or retardant, fire resistant or retardant
- B32B 2307/554: Wear resistance
- B32B 2307/734: Dimensional stability
- B32B 2307/748: Releasability
- B32B 2457/08: PCBs, i.e. printed circuit boards
- C08J 2363/00: Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J 2371/12: Polyphenylene oxides
- H05K 2201/012: Flame-retardant; Preventing of inflammation
- H05K 2201/0209: Inorganic, non-metallic particles
- H05K 2201/029: Woven fibrous reinforcement or textile
- H05K 2203/0786: Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K 2203/122: Organic non-polymeric compounds, e.g. oil, wax or thiol
- H05K 2203/125: Inorganic compounds, e.g. silver salt
- C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A high thermal conductivity prepreg is provided. The high thermal conductivity prepreg includes a high thermal conductivity reinforcing material and a dielectric material layer formed on the surface of the high thermal conductivity reinforcing material, wherein the high thermal conductivity reinforcing material is prepared by a process which includes the following steps: (a) providing a precursor aqueous solution, the precursor aqueous solution includes a precursor selected from the group of organic salts, inorganic salts, and combinations thereof; (b) subjecting the precursor aqueous solution to a hydrolysis reaction to form an intermediate product aqueous solution; (c) subjecting the intermediate product aqueous solution to a condensation polymerization reaction to form a pretreatment solution; (d) impregnating a reinforcing material with the pretreatment solution; and (e) oven-drying the impregnated reinforcing material to obtain the high thermal conductivity reinforcing material.

## Claims

### Claim 1

A high thermal conductivity prepreg, comprising a pretreated reinforcing material and a dielectric material layer formed on a surface of the pretreated reinforcing material; wherein the pretreated reinforcing material comprises a reinforcing material and a high thermal conductivity material; and wherein the pretreated reinforcing material is prepared by a process which comprises the following steps:
(a) providing an aqueous solution comprising a precursor of a high thermal conductivity component, wherein the precursor of the high thermal conductivity component is a combination of an organic salt and an inorganic salt;
(b) subjecting the aqueous solution to a hydrolysis reaction;
(c) subjecting the hydrolyzed aqueous solution to a condensation polymerization reaction to form a pretreatment solution comprising the high thermal conductivity component;
(d) impregnating the reinforcing material with the pretreatment solution; and
(e) oven-drying the impregnated reinforcing material to obtain the pretreated reinforcing material comprising the reinforcing material and the high thermal conductivity material.

### Claim 2 (depends on 1)

The high thermal conductivity prepreg of claim 1, wherein the organic salt is selected from the group consisting of aluminum methylate, aluminum ethylate, aluminum isopropylate, aluminum butylate, zinc acetate, and magnesium acetate.

### Claim 3 (depends on 1)

The high thermal conductivity prepreg of claim 1, wherein the inorganic salt is zinc nitrate or aluminum nitrate.

### Claim 4 (depends on 1)

The high thermal conductivity prepreg of claim 1, wherein the organic salt and the inorganic salt are provided in a molar ratio of from 1:1 to 5:1.

### Claim 5 (depends on 1)

The high thermal conductivity prepreg of claim 1, wherein the process, before step (c), further comprises a step of adding an additive to the hydrolyzed aqueous solution, and the additive is selected from the group consisting of sodium bis-2-ethylhexyl sulfosuccinate, sodium dodecyl benzene sulfonate, and combinations thereof.

### Claim 6 (depends on 1)

The high thermal conductivity prepreg of claim 1, wherein the condensation polymerization reaction of step (c) is carried out at 20° C. to 90° C.

### Claim 7 (depends on 1)

The high thermal conductivity prepreg of claim 1, wherein the oven-drying of step (e) is carried out at 300° C. to 700° C. for 1 to 20 minutes.

### Claim 8 (depends on 1)

The high thermal conductivity prepreg of claim 1, wherein the reinforcing material is a glass fiber cloth.

### Claim 9 (depends on 1)

The high thermal conductivity prepreg of claim 1, wherein the dielectric material layer is a cured product of a thermal-curable resin composition, wherein the thermal-curable resin composition comprises a thermal-curable resin and an optional hardener.

### Claim 10 (depends on 9)

The high thermal conductivity prepreg of claim 9, wherein the thermal-curable resin composition further comprises at least one selected from the group consisting of a catalyst, a flame retardant, a filler, a dispersing agent, and a toughener.

### Claim 11 (depends on 1)

A metal-clad laminate, which is prepared by laminating the high thermal conductivity prepreg of claim 1 and a metal foil.

### Claim 12 (depends on 11)

A printed circuit board, which is prepared from the metal-clad laminate of claim 11.

### Claim 13 (depends on 1)

A method for preparing the high thermal conductivity prepreg of claim 1, comprising: preparing the pretreated reinforcing material according to the process comprising steps (a), (b), (c), (d), and (e); and
(f) forming the dielectric material layer on a surface of the pretreated reinforcing material, thereby obtaining the high thermal conductivity prepreg.

### Claim 14 (depends on 13)

The method of claim 13, wherein the organic salt is selected from the group consisting of aluminum methylate, aluminum ethylate, aluminum isopropylate, aluminum butylate, zinc acetate, and magnesium acetate.

### Claim 15 (depends on 13)

The method of claim 13, wherein the inorganic salt is zinc nitrate or aluminum nitrate.

### Claim 16 (depends on 13)

The method of claim 13, wherein the organic salt and the inorganic salt are provided in a molar ratio of from 1:1 to 5:1.

### Claim 17 (depends on 13)

The method of claim 13, further comprising, before step (c), a step of adding an additive to the hydrolyzed aqueous solution, and the additive is selected from the group consisting of sodium bis-2-ethylhexyl sulfosuccinate, sodium dodecyl benzene sulfonate, and combinations thereof.

### Claim 18 (depends on 13)

The method of claim 13, wherein the condensation polymerization reaction of step (c) is carried out at 20° C. to 90° C.

### Claim 19 (depends on 13)

The method of claim 13, wherein the oven-drying of step (e) is carried out at 300° C. to 700° C. for 1 to 20 minutes.

### Claim 20 (depends on 13)

The method of claim 13, wherein the reinforcing material is a glass fiber cloth.