# US 11,306,220 B2 · Flexible encapsulating material, process for preparing the same and encapsulating method using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,306,220 B2 - Document ID: US11306220B2 - Status: Granted - Kind: B2 - Application number: 16/691,618 - Filed: 2019-11-22 - Published: 2020-06-11 - Granted: 2022-04-19 - Earliest claimed: 2018-12-10 - Assignees: eChem Solutions Corp. - Applicants: eChem Solutions Corp. - Inventors: Zong-Hao Tang; Hsin-Jen Chen - Web page: https://patentgrep.com/patent/US11306220B2 ## CPC - C08G 65/2612: {containing aromatic or arylaliphatic hydroxyl groups} - C08G 59/245: {aromatic} - C08G 59/4215: {cycloaliphatic} - C08G 59/4223: {aromatic} - C08G 59/688: {containing phosphorus} - C09D 163/00: Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins - H10K 59/873: {Encapsulations} - H10K 85/141: {comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE} - H10K 2102/311: {Flexible OLED} - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D) - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract A flexible encapsulating material, a method for preparing the flexible encapsulating material, and an encapsulating method using the flexible encapsulating material are provided. The flexible encapsulating material includes an epoxy resin represented by a Formula (1), a curing agent, and a curing accelerator and optionally includes a coupling agent, wherein based on 100 parts by weight of a total usage amount of the epoxy resin (A), the curing agent (B), and the curing accelerator (C), a usage amount of the epoxy resin (A) is 85 parts by weight or more, and based on 100 parts by weight of the usage amount of the epoxy resin (A), a usage amount of the coupling agent (D) is 0 to 5 parts by weight. ## Claims ### Claim 1 A flexible encapsulating material, comprising: an epoxy resin (A) represented by a formula (1), in the formula (1), A1 is a group selected from the group consisting of groups represented by a formula (a-1), a formula (a-2) and a formula (a-3), in the formula (a-1), n1 is an integer of 1 to 8, in the formula (a-2), n2 is an integer of 1 to 8, in the formula (a-3), n3 is an integer of 1 to 8, A2 is a divalent organic group having at least one of an aromatic structure and an alicyclic structure, B is a glycidyl group, n is an integer of 1 or more; a curing agent (B); and a curing accelerator (C), wherein, based on 100 parts by weight of a total usage amount of the epoxy resin (A), the curing agent (B), and the curing accelerator (C), a usage amount of the epoxy resin (A) is 85 parts by weight or more, and the flexible encapsulating material comprises a coupling agent (D) in a usage amount of greater than or equal to 0 part by weight and less than 5 parts by weight based on 100 parts by weight of the usage amount of the epoxy resin (A). ### Claim 2 (depends on 1) The flexible encapsulating material of claim 1, wherein the usage amount of the coupling agent (D) is 0.1 to 2 parts by weight. ### Claim 3 (depends on 2) The flexible encapsulating material of claim 2, wherein based on 100 parts by weight of the usage amount of the epoxy resin (A), a usage amount of the curing agent (B) is 5 to 12 parts by weight, and a usage amount of the curing accelerator (C) is 0.01 to 0.1 part by weight. ### Claim 4 (depends on 1) The flexible encapsulating material of claim 1, wherein A2 is a group represented by a formula (3), in the formula (3), X is a single bond or a C1-3 divalent hydrocarbon group. ### Claim 5 (depends on 1) The flexible encapsulating material of claim 1, wherein the epoxy resin (A) has a weight average molecular weight of 8,000 to 14,000 g/mol. ### Claim 6 (depends on 1) The flexible encapsulating material of claim 1, wherein the flexible encapsulating material has a weight average molecular weight of 13,000 to 35,000 g/mol. ### Claim 7 (depends on 1) An encapsulating method comprising: applying the flexible encapsulating material of claim 1 to a cover plate; and attaching the flexible encapsulating material to a substrate with an electronic component to cover the electronic component, wherein the flexible encapsulating material is located between the cover plate and the substrate with the electronic component. ### Claim 8 (depends on 7) The encapsulating method of claim 7, further comprising covering the electronic component with a gas barrier layer before attaching the flexible encapsulating material to the substrate with the electronic component. ### Claim 9 (depends on 7) The encapsulating method of claim 7, wherein the electronic component is a display component. ### Claim 10 A method for preparing a flexible encapsulating material, comprising: mixing an epoxy resin (A) represented by a formula (1), a curing agent (B), a curing accelerator (C) and a solvent (E) to form a mixture, wherein based on 100 parts by weight of a total usage amount of the epoxy resin (A), the curing agent (B), and the curing accelerator (C), a usage amount of the epoxy resin (A) is 85 parts by weight or more reacting the mixture at an elevated temperature of 100° C. or higher to form a resin composition; and adding a coupling agent (D) to the resin composition to form the flexible encapsulating material, wherein the coupling agent (D) is in a usage amount of greater than or equal to 0 part by weight and less than 5 parts by weight based on 100 parts by weight of the usage amount of the epoxy resin (A), in the formula (1), A1 is a group selected from the group consisting of groups represented by a formula (a-1), a formula (a-2) and a formula (a-3)1 in the formula (a-1), n1 is an integer of 1 to 8, in the formula (a-2), n2 is an integer of 1 to 8, in the formula (a-3), n3 is an integer of 1 to 8, A2 is a divalent organic group having an aromatic structure, an alicyclic structure, or both, B is a glycidyl group, n is an integer of 1 or more. ### Claim 11 (depends on 10) The method for preparing a flexible encapsulating material of claim 10, wherein based on 100 parts by weight of the usage amount of the epoxy resin (A), a usage amount of the curing agent (B) is 5 to 12 parts by weight, a usage amount of the curing accelerator (C) is 0.01 to 0.1 part by weight, and a usage amount of the coupling agent (D) is 0.1 to 2 parts by weight.