# US 11,306,217 B2 · Method for bonding substrate and substrate for display manufactured by the same

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- Number: US 11,306,217 B2
- Document ID: US11306217B2
- Status: Granted
- Kind: B2
- Application number: 16/327,658
- Filed: 2017-11-08
- Published: 2020-04-23
- Granted: 2022-04-19
- Earliest claimed: 2016-12-08
- Assignees: LG Chem, Ltd.
- Applicants: LG Chem, Ltd.
- Inventors: Seung A Back; Joon Hyung Kim
- Web page: https://patentgrep.com/patent/US11306217B2

## CPC

- C09D 11/30: Inkjet printing inks
- B32B 37/1292: {selectively, e.g. in stripes, in patterns (B32B37/0076 takes precedence)}
- B32B 38/145: {Printing}
- C09D 11/101: Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
- C09J 5/00: Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J 5/02: involving pretreatment of the surfaces to be joined
- B32B 2310/0831: using UV radiation
- B32B 2457/20: Displays, e.g. liquid crystal displays, plasma displays
- B41M 3/006: {Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles}
- B41M 5/0047: {by ink-jet printing}
- B41M 5/0058: {on metals and oxidised metal surfaces}
- B41M 5/007: {on glass, ceramic, tiles, concrete, stones, etc.}
- B41M 7/0081: {using electromagnetic radiation or waves, e.g. ultraviolet radiation, electron beams}
- C09J 2301/416: use of irradiation
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- B41M: PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING, (correction of typographical errors B41J; processes for applying transfer pictures or the like B44C1/16; fluid media for correction of typographical errors by coating C09D10/00; printing textiles D06P)

## Abstract

The present invention relates to a method of bonding substrates and a substrate for displays manufactured by the same. In an embodiment, the method comprises (a) printing a first photocurable adhesive ink on the lower substrate to form a pattern; (b) photocuring the pattern to form a spacer on the lower substrate; (c) printing a second photocurable adhesive ink on the lower substrate, which includes the spacer, to form an adhesive layer; (d) irradiating the adhesive layer with light; and (e) laminating the upper substrate to the lower substrate via the adhesive layer, wherein the upper and lower substrates are transparent or opaque, and wherein the upper and lower substrates comprise the same or different materials.

## Claims

### Claim 1

A method for bonding substrates, comprising:
(a) printing a first photocurable adhesive ink on a lower substrate to form a pattern;
(b) photocuring the pattern to form a spacer on the lower substrate;
(c) printing a second photocurable adhesive ink on the lower substrate, which includes the spacer disposed thereon, to form an adhesive layer, wherein the first and second photocurable adhesive inks are the same or different;
(d) irradiating the adhesive layer with light; and
(e) laminating an upper substrate to the lower substrate via the irradiated adhesive layer to form bonded substrates comprising the upper substrate, the lower substrate, the adhesive layer, and the spacer, wherein the upper and lower substrates are spaced apart by the height of the spacer,
wherein each of the upper and lower substrates is transparent or opaque, and wherein the upper and lower substrates comprise same or different materials.

### Claim 2 (depends on 1)

A method for bonding substrates according to claim 1, wherein the lower substrate is a transparent glass or transparent film, or an opaque substrate selected from the group consisting of a color filter, a black matrix (BM), a thin film transistor (TFT), and a silicon wafer.

### Claim 3 (depends on 1)

A method for bonding substrates according to claim 1, wherein the adhesive layer of the step (d) is irradiated with light to partially cure the adhesive layer.

### Claim 4 (depends on 1)

A method for bonding substrates according to claim 1, wherein the amount of light irradiated on the adhesive layer is 1/100 to ⅓ of an amount of light used to photocure the pattern in the step (b).

### Claim 5 (depends on 1)

A method for bonding substrates according to claim 1, wherein the step (e) further comprises:
heat treating the upper and lower substrates to reduce the laminating time.

### Claim 6 (depends on 5)

A method for bonding substrates according to claim 5, wherein the heat treatment of the step (e) is performed using a hot-plate or a drying oven at a temperature of 50° C. to 150° C. for 1 to 100 seconds.

### Claim 7 (depends on 1)

A method for bonding substrates according to claim 1, wherein the upper substrate is a transparent glass or transparent film, or an opaque substrate selected from the group consisting of a color filter, a black matrix (BM), a thin film transistor (TFT), and a silicon wafer.

### Claim 8 (depends on 1)

A method for bonding substrates according to claim 1, wherein the thickness of the adhesive layer is 3 to 12 μm.

### Claim 9 (depends on 1)

A method for bonding substrates according to claim 1, wherein the pattern of step (b) is cured only by photocuring or by a combination of photocuring and heat treatment, wherein the heat treatment accelerates a curing rate after cations are formed by photocuring.

### Claim 10 (depends on 9)

A method for bonding substrates according to claim 9, wherein the photocurable adhesive ink is an ultraviolet (UV) curing ink or an electron beam curing ink.

### Claim 11 (depends on 1)

A method for bonding substrates according to claim 1, wherein the photocuring in the step (b) further comprises:
irradiating the pattern with ultraviolet (UV) light for 5 seconds to 500 seconds at an intensity of 50 mW/cm2 to 500 mW/cm2, or irradiating the pattern with an electron beam for 5 seconds to 500 seconds.

### Claim 12 (depends on 1)

A method for bonding substrates according to claim 1, wherein step (d) further comprises:
irradiating the adhesive layer with ultraviolet (UV) light for 5 seconds to 500 seconds at an intensity of 5 mW/cm2 to 50 mW/cm2, or irradiating the adhesive layer with an electron beam for 5 seconds to 500 seconds.

### Claim 13 (depends on 1)

A method for bonding substrates according to claim 1, wherein the printing in steps (a) and (c) is inkjet printing.

### Claim 14 (depends on 1)

A substrate for displays manufactured by the method according to claim 1.