# US 11,306,211 B2 · Porosity reduction by encapsulated polymerizing agents

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- Number: US 11,306,211 B2
- Document ID: US11306211B2
- Status: Granted
- Kind: B2
- Application number: 16/546,496
- Filed: 2019-08-21
- Published: 2021-02-25
- Granted: 2022-04-19
- Earliest claimed: 2019-08-21
- Assignees: International Business Machines Corporation
- Applicants: International Business Machines Corporation
- Inventors: Eric J. Campbell; Sarah K. Czaplewski-Campbell; Brandon M. Kobilka; Jason T. Wertz
- Web page: https://patentgrep.com/patent/US11306211B2

## CPC

- C08G 73/1085: {Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties}
- C09D 4/06: {Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond} in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
- B29C 64/153: using layers of powder being selectively joined, e.g. by selective laser sintering or melting
- B33Y 10/00: Processes of additive manufacturing
- B33Y 70/00: Materials specially adapted for additive manufacturing
- B33Y 80/00: Products made by additive manufacturing
- C08G 73/1042: {Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds}
- C08G 73/105: {with oxygen only in the diamino moiety}
- C08G 73/1071: {Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain}
- C09D 5/031: {characterised by particle size or shape}
- C09D 177/00: Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain (based on polyhydrazides C09D179/06; based on polyamide-imides C09D179/08); Coating compositions based on derivatives of such polymers
- C09D 177/02: Polyamides derived from omega-amino carboxylic acids or from lactams thereof (C09D177/10 takes precedence)
- B29C 64/393: for controlling or regulating additive manufacturing processes
- B29K 2077/00: Use of {PA, i.e.} polyamides, e.g. polyesteramides {or derivatives thereof}, as moulding material
- B29K 2105/0076: {Microcapsules}
- B29K 2995/0063: Density
- B33Y 50/02: for controlling or regulating additive manufacturing processes
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B33Y: ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS

## Abstract

A method, composition, and article of manufacture. The method can include depositing a layer, which includes a set of particles and a set of microcapsules encapsulating polymerizing agents. The method can also include fusing particles in selected areas of the layer with a laser, and rupturing at least a portion of microcapsules using at least one energy source selected from the laser, an ultraviolet (UV) radiation source, and a heat source. The composition can include a set of particles and a set of microcapsules, each containing a polymerizing agent encapsulated by a degradable shell. The article of manufacture can include fused layers that include fused particles and pores sealed in reactions with polymerizing agents released from degradable microcapsules.

## Claims

### Claim 1

A method, comprising:
depositing a layer, the layer comprising a set of particles and a set of microcapsules encapsulating polymerizing agents;
fusing, by a laser, particles from the set of particles, wherein the fused particles are in selected areas of the layer; and
rupturing, by an energy source, at least one portion of microcapsules from the set of microcapsules, wherein the energy source is at least one energy source selected from the group consisting of the laser, an ultraviolet (UV) radiation source, and a heat source.

### Claim 2 (depends on 1)

The method of claim 1, wherein the UV radiation source exposes the at least one portion of microcapsules to electromagnetic radiation having a wavelength below approximately 260 nm.

### Claim 3 (depends on 1)

The method of claim 1, wherein the heat source heats the at least one portion of microcapsules to a temperature of approximately 140° C.-180° C.

### Claim 4 (depends on 1)

The method of claim 1, wherein the rupturing the at least one portion of microcapsules releases the polymerizing agents into pores in the selected areas of the layer.

### Claim 5 (depends on 4)

The method of claim 4, further comprising curing the released polymerizing agents.

### Claim 6 (depends on 1)

The method of claim 1, wherein each particle in the set of particles has a diameter between approximately 20 μm and 200 μm.

### Claim 7 (depends on 1)

The method of claim 1, wherein each microcapsule in the set of microcapsules has a diameter between approximately 20 μm and 200 μm.

### Claim 8 (depends on 1)

The method of claim 1, wherein fusing comprises rastering a laser over the selected areas of the layer according to a pattern from a computer-aided design (CAD) file.

### Claim 9 (depends on 1)

The method of claim 1, wherein the weight percent of the set of microcapsules in the layer is in a range of approximately 2.5-5 wt %.

### Claim 10 (depends on 1)

The method of claim 1, wherein the layer has a thickness of approximately 0.20 mm.