System and methods for microfabrication

A method, comprising:

• adhering a first surface of a mask to a carrier substrate via a first adhesive layer, at least one of the mask or the carrier substrate having a first alignment mark, the mask having a pattern of openings;
• forming a second adhesive layer on at least one of a second surface of the mask or a third surface of a wafer having a second alignment mark, the second surface being on an opposite side of the mask relative to first surface, the second surface and the third surface being kept parallel with each other by a plurality of proximity flags, the proximity flags not in contact with the second adhesive layer;
• removing the proximity flags;
• bringing the carrier substrate and the wafer towards each other along a vertical axis such that the second surface of the mask and the third surface of the wafer is separated by an alignment gap based on a thickness of the second adhesive layer;
• performing an alignment operation based on imaging the first alignment mark and the second alignment mark, the alignment operation comprising moving at least one of the carrier substrate or the wafer on a horizontal plane perpendicular to the vertical axis when the mask is separated from the third surface by a distance;
• after the alignment operation completes:
• bringing the carrier substrate and wafer towards each other along the vertical axis such that the second surface of the mask adheres to the third surface of the wafer via the second adhesive layer;
• disconnecting the carrier substrate from the mask based on weakening the first adhesive layer when the mask remains adhered to the third surface via the second adhesive layer;
• depositing material via the pattern of openings of the mask to form a pattern of material on the third surface of the wafer;
• and
• after forming the pattern of material on the third surface, disconnecting the mask from the third surface based on weakening the second adhesive layer.