# US 11,305,984 B2 · Water proofing and water detection schemes for MEMS-based environmental sensing devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,305,984 B2 - Document ID: US11305984B2 - Status: Granted - Kind: B2 - Application number: 16/831,706 - Filed: 2020-03-26 - Published: 2020-07-16 - Granted: 2022-04-19 - Earliest claimed: 2017-09-29 - Assignees: Apple Inc. - Applicants: Apple Inc. - Inventors: Krishna Prasad Vummidi Murali; Kuolung Lei; Richard Yeh; Yun X. Ma - Web page: https://patentgrep.com/patent/US11305984B2 ## CPC - B81B 7/0058: {for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations} - B81B 7/0029: {Protection against environmental influences not provided for in groups B81B7/0012 - B81B7/0025} - B81B 7/0077: {Other packages not provided for in groups B81B7/0035 - B81B7/0074} - B81C 1/0023: {Packaging together an electronic processing unit die and a micromechanical structure die (MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261)} - B81B 2201/0214: Biosensors; Chemical sensors - B81B 2201/0264: Pressure sensors - B81B 2201/0278: Temperature sensors - B81B 2203/0127: Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function - B81B 2203/04: Electrodes - B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package - B81B 2207/096: through the substrate - B81C 2203/0136: Growing or depositing of a covering layer - B81C 2203/0792: Forming interconnections between the electronic processing unit and the micromechanical structure - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) ## Abstract A waterproofed environmental sensing device with water detection provisions includes an environmental sensor to sense one or more environmental properties. The device further includes an electronic integrated circuit implemented on a substrate and coupled to the environmental sensor via a wire bonding. An air-permeable cap structure is formed over the environmental sensor, and a protective layer is formed over the wire bonding to protect the wire bonding against damage. ## Claims ### Claim 1 A device comprising: an environmental sensor embedded in an electro-mechanical system (MEMS) structure; an electronic integrated circuit (IC); and one or more passive elements, wherein: the device is partially enclosed in an enclosure, the enclosure is at least partially filled with a sensor gel, and the one or more passive elements are at least partially exposed above the sensor gel. ### Claim 2 (depends on 1) The device of claim 1, wherein the one or more passive elements comprise capacitive elements and are coupled to the electronic IC, and wherein the passive elements are configured to detect presence of at least water and oil above the sensor gel. ### Claim 3 (depends on 2) The device of claim 2, wherein the electronic IC includes a strain isolation provision, and wherein the electronic IC includes resistive routings configured to allow TCO calibration. ### Claim 4 (depends on 2) The device of claim 2, further comprising a membrane configured to provide strain isolation, wherein the membrane is made of a material including silicone rubber. ### Claim 5 (depends on 4) The device of claim 4, wherein the environmental sensor is coupled to the electronic IC via a wire bonding, and wherein the membrane is formed between the MEMS structure and the electronic IC. ### Claim 6 (depends on 4) The device of claim 4, further comprising a land grid array (LGA) layer, wherein the MEMS structure is wire bonded to the LGA layer. ### Claim 7 (depends on 6) The device of claim 6, wherein at least one of the LGA layer or the electronic integrated circuit includes resistive-routing for TCO calibration. ### Claim 8 A device comprising: an environmental sensor configured to sense one or more environmental properties; an integrated circuit (IC) coupled to the environmental sensor via a wire bonding; a protective layer formed over the wire bonding to protect the wire bonding against a potential damage; and interdigitated electrodes implementing capacitors capable of detecting environmental aggressors including water, and wherein the interdigitated electrodes are realized using a top metal layer and passivation. ### Claim 9 (depends on 8) The device of claim 8, further comprising an air-permeable cap structure formed over the environmental sensor and configured to protect a surface of the environmental sensor from environmental aggressors including water and oil. ### Claim 10 (depends on 9) The device of claim 9, wherein the air-permeable cap structure is made of a suitable material including silicon, and wherein the air-permeable cap structure includes a coated hydrophobic layer. ### Claim 11 (depends on 8) The device of claim 8, wherein the environmental sensor is formed in an electro-mechanical system (MEMS) structure and wire bonded to the IC through an interposer including through-silicon vias (TSVs). ### Claim 12 (depends on 11) The device of claim 11, wherein the MEMS structure is configured to provide strain isolation for the environmental sensor. ### Claim 13 (depends on 11) The device of claim 11, wherein the IC is used as a package substrate, wherein strain isolation provisions are implemented in at least one of the IC or the MEMS structure, and wherein the MEMS structure and the interposer are coupled to the IC via flip-chip bonding. ### Claim 14 (depends on 11) The device of claim 11, wherein the IC is implemented side-by-side with the MEMS structure and includes one or more capacitive elements configured to detect presence of at least water and oil.