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US 11,305,553 B2Granted
Thermal print head and method of manufacturing thermal print head
AssigneeRohm Co., Ltd.
InventorIsamu Nishimura
Life of this patent
Estimating the term…
Abstract
A thermal print head includes: a substrate; a resistor layer supported by the substrate and including a plurality of heat generating portions arranged in a main scanning direction; a wiring layer supported by the substrate and forming an energizing path to the plurality of heat generating portions; and an insulating layer interposed between the substrate and the resistor layer, wherein the substrate has a cavity portion overlapping the plurality of heat generating portions when viewed in a thickness direction of the substrate.
Claims16
A thermal print head comprising:
- a substrate;
- a resistor layer supported by the substrate and including a plurality of heat generating portions arranged in a main scanning direction;
- a wiring layer supported by the substrate and forming an energizing path to the plurality of heat generating portions;
- and
- an insulating layer interposed between the substrate and the resistor layer,
- wherein the substrate has a plurality of cavity portions overlapping the plurality of heat generating portions when viewed in a thickness direction of the substrate,
- wherein the plurality of cavity portions is sealed by the substrate when viewed in the main scanning direction, and
- wherein the plurality of cavity portions is arranged in the thickness direction to respectively overlap each other when viewed in the thickness direction.
5 more elements
A method of manufacturing a thermal print head, comprising:
- forming a plurality of holes recessed from a main surface in a substrate material made of a single crystal semiconductor;
- forming a plurality of cavity portions in the substrate material;
- forming an insulating layer covering the main surface;
- forming a resistor layer on the insulating layer;
- and
- forming a wiring layer on the resistor layer,
- wherein the forming the plurality of cavity portions includes:
- connecting bottom portions of the plurality of holes;
- and
- closing opening portions of the plurality of holes,
- wherein a plurality of heat generating portions, which are portions of the resistor layer exposed from the wiring layer and are arranged in a main scanning direction, and the plurality of cavity portions overlap with each other when viewed in a thickness direction of the substrate material,
- wherein the plurality of cavity portions is sealed by the substrate material when viewed in the main scanning direction, and
- wherein the plurality of cavity portions is formed to be arranged in the thickness direction to respectively overlap each other when viewed in the thickness direction.
10 more elements
Dependencies are inferred from the claim text.