# US 11,304,599 B2 · Endoscope having electromagnetic shield

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- Number: US 11,304,599 B2
- Document ID: US11304599B2
- Status: Granted
- Kind: B2
- Application number: 16/627,844
- Filed: 2018-08-22
- Published: 2020-06-11
- Granted: 2022-04-19
- Earliest claimed: 2017-08-30
- Assignees: Hoya Corporation
- Applicants: Hoya Corporation
- Inventors: Atsushi Komoro
- Web page: https://patentgrep.com/patent/US11304599B2

## CPC

- A61B 1/00096: {Optical elements}
- A61B 1/051: {Details of CCD assembly}
- A61B 1/05: characterised by the image sensor, e.g. camera, being in the distal end portion
- G02B 23/24: Instruments {or systems} for viewing the inside of hollow bodies, e.g. fibrescopes
- H04N 23/52: Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
- H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
- H04N 23/555: {for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes}
- A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D)
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION

## Abstract

An endoscope includes an objective lens provided at a distal end portion of an insertion portion, an image sensor in which a light receiving area is formed on a surface facing the objective lens, and a drive circuit substrate that is disposed on a back side of the image sensor and includes a drive circuit to drive the image sensor, the endoscope further including an electromagnetic shield that houses the image sensor and the drive circuit substrate, in which the electromagnetic shield includes: a first shield member including a cylinder that covers a side portion of the image sensor, a structure that is disposed between the image sensor and the objective lens and that has an opening that allows entrance of light from the objective lens, and a wiring pattern that is formed on an inner peripheral surface of the cylinder and the structure.

## Claims

### Claim 1

An endoscope comprising:
an objective lens provided at a distal end portion of an insertion portion, an image sensor in which a light receiving area is formed on a surface facing the objective lens, and a drive circuit substrate that is disposed on a back side of the image sensor and includes a drive circuit to drive the image sensor,
the endoscope further comprising an electromagnetic shield that houses the image sensor and the drive circuit substrate,
wherein the electromagnetic shield includes:
a first shield member including
a cylinder that covers a side portion of the image sensor,
a structure that is disposed between the image sensor and the objective lens and that has an opening that allows entrance of light from the objective lens, and
a wiring pattern that is formed on an inner peripheral surface of the cylinder and the structure and provided to electrically connect the image sensor and the drive circuit substrate; and
a second shield member externally fitted on a rear end side of the first shield member.

### Claim 2 (depends on 1)

The endoscope according to claim 1, further comprising:
a bump connected to one end of the wiring pattern and provided at a site of the structure facing the image sensor; and
a land connected to the other end of the wiring pattern and provided to ensure conduction with the drive circuit mounted on the drive circuit substrate.

### Claim 3 (depends on 2)

The endoscope according to claim 2,
wherein the drive circuit substrate is mounted on the cylinder in a state where a front surface of the drive circuit substrate and a rear end surface of the cylinder face each other.

### Claim 4 (depends on 3)

The endoscope according to claim 3,
wherein the drive circuit substrate includes a cutout portion cut out in a thickness direction of the drive circuit substrate so as to expose a part of the land.

### Claim 5 (depends on 2)

The endoscope according to claim 2,
wherein the drive circuit substrate is mounted on the cylinder in a state where a side surface of the drive circuit substrate and an inner peripheral surface of the cylinder face each other.

### Claim 6 (depends on 2)

The endoscope according to claim 2,
wherein the image sensor is mounted in the electromagnetic shield via the bump.

### Claim 7 (depends on 1)

The endoscope according to claim 1,
wherein the cylinder and the structure are integrally formed and include a base formed of a conductive material and an insulating layer formed on an inner peripheral surface of the base.

### Claim 8 (depends on 1)

The endoscope according to claim 1,
wherein the cylinder and the structure are integrally formed and include a base formed of an insulating material and a conductive layer formed on an outer peripheral surface of the base.

### Claim 9 (depends on 1)

The endoscope according to claim 1,
wherein an internal space of the second shield member is filled with an insulating filler.