# US 11,299,813 B2 · Method for manufacturing hologram pattern and specimen including metal plating layer having hologram pattern on surface thereof

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- Number: US 11,299,813 B2
- Document ID: US11299813B2
- Status: Granted
- Kind: B2
- Application number: 16/307,529
- Filed: 2017-05-11
- Published: 2019-11-14
- Granted: 2022-04-12
- Earliest claimed: 2016-06-07
- Applicants: Seong-Tae No
- Inventors: Seong-Tae No
- Web page: https://patentgrep.com/patent/US11299813B2

## CPC

- C25D 5/48: After-treatment of electroplated surfaces
- C25D 3/12: of nickel or cobalt
- C25D 3/46: of silver
- C25D 3/48: of gold
- C25D 3/50: of platinum group metals
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR

## Abstract

According to a method for manufacturing a hologram pattern of the present invention, the hologram pattern is applied to a metal plating layer (not a metal specimen). Accordingly, materials which can be plated are widely applicable. The hologram pattern, which becomes appeared in various colors depending on light and user's vision, can be formed with a simple process.

## Claims

### Claim 1

A method for manufacturing a hologram pattern, the method comprising:
immersing a plating specimen in a plating tank containing a plating solution and applying a voltage to the plating specimen to form a plating layer on the surface of the plating specimen;
creating a pattern on the plating specimen including a hologram pattern on the surface of the plating layer,
wherein the hologram pattern is created by irradiating a laser on the surface of the plating layer to remove a portion of the plating layer,
wherein the laser is a pulse laser and has a pulse length of 5 ns to 30 ns,
wherein the pulse laser has a frequency of 500 kHz to 1,000 kHz, and
wherein irradiating the surface of the plating layer to create the hologram pattern comprises forming an unevenness in the surface of the plating layer that is repeated in parallel and an interval of the unevenness is 0.05 μm to 1 μm.

### Claim 2 (depends on 1)

The method of claim 1, wherein the plating solution is at least one selected from the group consisting of a nickel electroplating solution, a cobalt electroplating solution, a black nickel electroplating solution, a silver electroplating solution, a gold electroplating solution and a rhodium electroplating solution.

### Claim 3 (depends on 1)

The method of claim 1, further comprising forming a color layer wherein the color layer is formed on the surface of the plating specimen having the hologram pattern thereon.

### Claim 4 (depends on 3)

The method of claim 3, wherein the color layer is formed by color plating and includes at least one selected from the group consisting of a gold plating layer, a black nickel plating layer, a chrome plating layer, a rose-gold plating layer and a combination thereof.

### Claim 5 (depends on 1)

The method of claim 1, wherein the plating solution is a nickel electroplating solution and contains nickel sulfamic acid of 400 g to 600 g and nickel chloride of 40 g to 60 g in 1 liter of the plating solution.

### Claim 6 (depends on 1)

The method of claim 1, wherein the plating layer has a thickness of 7μ to 100 μm.