# US 11,299,655 B2 · Highly-dielectric, elastic structure and a touch sensor including the same

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- Number: US 11,299,655 B2
- Document ID: US11299655B2
- Status: Granted
- Kind: B2
- Application number: 16/460,195
- Filed: 2019-07-02
- Published: 2020-06-18
- Granted: 2022-04-12
- Earliest claimed: 2018-12-14
- Assignees: Korea Institute of Science and Technology
- Applicants: Korea Institute of Science and Technology
- Inventors: Heesuk Kim; Youngpyo Ko; Min Park; Sang-Soo Lee; Jeong Gon Son; Jong Hyuk Park; Seungjun Chung; Tae Ann Kim
- Web page: https://patentgrep.com/patent/US11299655B2

## CPC

- C09J 7/30: characterised by the adhesive composition
- C08K 5/0025: {Crosslinking or vulcanising agents; including accelerators}
- C08K 9/06: with silicon-containing compounds
- C09J 7/25: based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
- C09J 7/38: Pressure-sensitive adhesives [PSA]
- C09J 9/02: Electrically-conducting adhesives
- C09J 11/04: inorganic
- G01D 5/24: by varying capacitance
- G06F 3/0414: {using force sensing means to determine a position}
- H01B 5/16: comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber (H01B1/14, H01B1/20 take precedence; insulating bodies with conductive admixtures H01B17/64; conductive paints C09D5/24)
- C08K 3/04: Carbon
- C08K 3/041: {Carbon nanotubes}
- C08K 3/042: {Graphene or derivatives, e.g. graphene oxides}
- C08K 3/045: {Fullerenes}
- C08K 3/08: Metals
- C08K 3/10: Metal compounds
- C08K 3/22: of metals
- C08K 5/0091: {Complexes with metal-heteroatom-bonds}
- C08K 7/06: Elements
- C08K 2201/001: Conductive additives
- C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors
- C09J 2301/308: the adhesive tape or sheet losing adhesive strength when being stretched, e.g. stretch adhesive
- C09J 2301/314: the adhesive layer and/or the carrier being conductive
- C09J 2301/408: additives as essential feature of the adhesive layer
- C09J 2301/41: additives as essential feature of the carrier layer
- C09J 2483/006: in the substrate
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- G01D: MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})

## Abstract

A highly-dielectric, elastic structure includes an elastic body that is highly-dielectric and includes a polymer matrix that including 1000 pbw of a polydimethylsiloxane (PDMS) base and 100 pbw of a PDMS curing agent, and has a tensile strength of 0.1 to 10 MPa; and 22.4 pbw of carbon black that is surface-treated with octadecyltrimethoxysilane (ODTMS) in an amount of at least 0.707 mmol per 22.4 pbw of the carbon black, and that is dispersed in the polymer matrix and cured; and an adhesive electrode that is stretchable, that is disposed on the elastic body, and that includes a polymer adhesive including a 500 pbw of a thermosetting silicone-based polymer adhesive including a curable polymer and a curing agent; and a conductive filler comprising 500 pbw of silver particles and 4000 pbw of a carbonaceous material that is a multi-walled carbon nanotube that are dispersed in the polymer adhesive and cured.

## Claims

### Claim 1

A highly-dielectric, elastic structure, comprising:
an elastic body that is highly-dielectric and comprises:
a polymer matrix that comprises 1000 parts by weight of a polydimethylsiloxane (PDMS) base and 100 parts by weight mg of a PDMS curing agent, and has a tensile strength of 0.1 to 10 MPa; and 22.4 parts by weight of carbon black that is a dielectric material and a conductive filler, that is surface-treated with octadecyltrimethoxysilane (ODTMS) in an amount of at least 0.707 mmol per 22.4 parts by weight of the carbon black, and that is dispersed in the polymer matrix and cured; and an adhesive electrode that is adhesive and stretchable, that is disposed on the body, and that comprises:
a polymer adhesive comprising a 500 parts by weight of a thermosetting silicone-based polymer adhesive including a curable polymer and a curing agent; and
a conductive filler comprising 1500 parts by weight of silver particles and 4000 parts by weight of a carbonaceous material that is a multi-walled carbon nanotube that are dispersed in the polymer adhesive and cured.

### Claim 2 (depends on 1)

The highly-dielectric, elastic structure according to claim 1, wherein the polymer matrix of the elastic body has a dielectric constant of 1-10.

### Claim 3 (depends on 1)

The highly-dielectric, elastic structure according to claim 1, wherein the polymer adhesive of the adhesive electrode comprises 5-20 parts by weight of the curing agent based on 100 parts by weight of the curable polymer.

### Claim 4 (depends on 1)

The highly-dielectric, elastic structure according to claim 1, wherein the polymer adhesive of the adhesive electrode has a bulk tensile strength of 0.1-10 MPa after curing.

### Claim 5 (depends on 1)

The highly-dielectric, elastic structure according to claim 1, wherein the polymer adhesive of the adhesive electrode has a volume shrinkage ratio of 1-10% after curing.

### Claim 6 (depends on 1)

The highly-dielectric, elastic structure according to claim 1, wherein the polymer adhesive comprises 10-120 parts by weight of the curing agent based on 100 parts by weight of the curable polymer.

### Claim 7 (depends on 1)

The highly-dielectric, elastic structure according to claim 1, wherein the metal of the conductive filler is a mixture of metal particles having a diameter of 100-200 nm, 1-4 μm, or 5-10 μm.

### Claim 8 (depends on 1)

The highly-dielectric, elastic structure according to claim 1, wherein the carbonaceous material of the conductive filler is a multi-walled carbon nanotube having a diameter of 15-40 nm and a length of 10-50 μm.

### Claim 9 (depends on 1)

The highly-dielectric, elastic structure according to claim 1, wherein the elastic body and the adhesive electrode are connected to each other to form a single structure.

### Claim 10 (depends on 1)

A touch sensor comprising the highly-dielectric, elastic structure according to claim 1.

### Claim 11 (depends on 10)

The touch sensor according to claim 10, wherein the touch sensor is a capacitance-type force sensor.