# US 11,299,642 B2 · Systems and methods of additive printing of functional electronic circuits

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- Number: US 11,299,642 B2
- Document ID: US11299642B2
- Status: Granted
- Kind: B2
- Application number: 16/133,356
- Filed: 2018-09-17
- Published: 2019-04-25
- Granted: 2022-04-12
- Earliest claimed: 2017-09-18
- Assignees: Morningbird Media Corporation
- Applicants: Morningbird Media Corporation
- Inventors: Chance M. Glenn
- Web page: https://patentgrep.com/patent/US11299642B2

## CPC

- C09D 11/104: Polyesters
- B29B 11/10: Extrusion moulding
- B29C 64/118: using filamentary material being melted, e.g. fused deposition modelling [FDM]
- B29C 64/291: for operating globally, e.g. together with selectively applied activators or inhibitors
- B33Y 10/00: Processes of additive manufacturing
- B33Y 70/00: Materials specially adapted for additive manufacturing
- C09D 11/02: Printing inks (C09D11/30 takes precedence)
- C09D 11/037: characterised by the pigment
- C09D 11/101: Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
- C09D 11/102: containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
- C09D 11/322: Pigment inks
- C09D 11/52: Electrically conductive inks
- H01B 1/24: the conductive material comprising carbon-silicon compounds, carbon or silicon
- H01B 3/421: {Polyesters}
- H01C 17/0652: {containing carbon or carbides}
- H01C 17/06586: {composed of organic material}
- H01G 4/1218: {based on titanium oxides or titanates (H01G4/1245 takes precedence)}
- H01G 4/33: Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)}
- H05K 3/1283: {After-treatment of the printed patterns, e.g. sintering or curing methods}
- H10P 14/26: using liquid deposition
- H10P 14/2922: {being non-crystalline insulating materials, e.g. glass or polymers}
- H10P 14/3411: {Silicon, silicon germanium or germanium}
- H10P 14/38: {characterised by treatments done after the formation of the materials}
- B29K 2063/00: Use of {EP, i.e.} epoxy resins {or derivatives thereof}, as moulding material
- B29K 2067/046: {PLA, i.e. polylactic acid or polylactide}
- B29K 2105/162: {Nanoparticles}
- B29K 2505/14: Noble metals, e.g. silver, gold or platinum
- H10P 14/265: {using solutions}
- H10P 14/3406: {Carbon, e.g. diamond-like carbon}
- H10P 14/3461: {Nanoparticles}
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- B29B: PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B33Y: ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- H01C: RESISTORS
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS

## Abstract

A composition, method, and system for directly printing and creating complete functional 3D electronic circuits and devices without any thermal or laser post-processing treatment, by using at least Triphenylamine (TPA) as a powder binding agent. The composition can have mechanical characteristics that allow it to be melted and extruded on a structure, and electrical properties that allow it to function as at least one of a conductor, insulator, resistor, p-type semiconductor, n-type semiconductor, or capacitor.

## Claims

### Claim 1

A composition for use in 3D printing of electronic devices, comprising:
at least Triphenylamine (TPA), wherein
the TPA is in powder form and is used as a powder binding agent in the composition, and
the composition is to be melted and extruded on a structure,
wherein:
the composition is insulating, and
the TPA forms about 99% of the composition by weight.

### Claim 2

A composition for use in 3D printing of electronic devices, comprising:
at least Triphenylamine (TPA), wherein
the TPA is in powder form and is used as a powder binding agent in the composition, and
the composition is to be melted and extruded on a structure,
wherein:
the composition is insulating,
Polylactide (PLA) forms about 25% of the composition by weight, and
the TPA forms about 75% of the composition by weight.

### Claim 3

A composition for use in 3D printing of electronic devices, comprising:
at least Triphenylamine (TPA), wherein
the TPA is in powder form and is used as a powder binding agent in the composition, and
the composition is to be melted and extruded on a structure,
wherein:
the composition is capacitive,
PLA forms at least about 30% of the composition by weight, and Titanium dioxide (TiO2) forms at least about 35% of the composition by weight, and
the TiO2 is in a powder form with particle size ranging from about 100 nm to about 100,000 nm.

### Claim 4

A composition for use in 3D printing of electronic devices, comprising:
at least Triphenylamine (TPA), wherein
the TPA is in powder form and is used as a powder binding agent in the composition, and
the composition is to be melted and extruded on a structure,
wherein:
the composition is semiconducting,
silver (Ag) forms at least about 5% of the composition by weight, and n-type Silicon semiconductor (Si—N) forms at least about 50% of the composition by weight, and
the Si—N is in a wafer form with a particle size of about 100 um.

### Claim 5

A composition for use in 3D printing of electronic devices, comprising:
at least Triphenylamine (TPA), wherein
the TPA is in powder form and is used as a powder binding agent in the composition, and
the composition is to be melted and extruded on a structure,
wherein:
the composition is semiconducting,
silver (Ag) forms at least about 5% of the composition by weight, and p-type Silicon semiconductor (Si—P) forms at least about 50% of the composition by weight, and
the Si—P is in a wafer form with a particle size of about 100 um.