# US 11,299,620 B2 · Epoxy resin composition, cured product, and electrical or electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,299,620 B2 - Document ID: US11299620B2 - Status: Granted - Kind: B2 - Application number: 16/897,421 - Filed: 2020-06-10 - Published: 2020-09-24 - Granted: 2022-04-12 - Earliest claimed: 2017-12-12 - Assignees: Mitsubishi Chemical Corporation - Applicants: Mitsubishi Chemical Corporation - Inventors: Kazumasa Oota - Web page: https://patentgrep.com/patent/US11299620B2 ## CPC - C08G 59/245: {aromatic} - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - C08G 59/063: {with epihalohydrins} - C08G 59/24: carbocyclic - C08G 59/3218: {Carbocyclic compounds} - C08G 59/38: together with di-epoxy compounds - C08L 2203/20: use in electrical or conductive gadgets - C08L 2205/025: containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) ## Abstract The present invention relates to an epoxy resin composition (A) containing an epoxy resin represented by the following formula (1): and an epoxy resin represented by the following formula (2): wherein in formula (2), n represents an integer of from 0 to 2, wherein a content of the epoxy resin represented by formula (1) is from 0.01 to 0.99% by weight, and relates to an epoxy resin composition (B) containing a curing agent in an amount of from 0.01 to 1000 parts by weight relative to 100 parts by weight of the epoxy resin composition (A). ## Claims ### Claim 1 An epoxy resin composition (A), comprising an epoxy resin represented by the following formula (1): and an epoxy resin represented by the following formula (2): wherein in formula (2), n represents an integer of from 0 to 2, wherein a content of the epoxy resin represented by formula (1) is from 0.01 to 0.99% by weight. ### Claim 2 (depends on 1) The epoxy resin composition (A) according to claim 1, wherein among the epoxy resin represented by formula (2), an epoxy resin in which n=0 is contained in an amount of from 49.2 to 89.0% by weight, an epoxy resin in which n=1 is contained in an amount of from 8.2 to 39.2% by weight, and an epoxy resin in which n=2 is contained in an amount of from 0.1 to 7.5% by weight. ### Claim 3 (depends on 2) The epoxy resin composition (A) according to claim 2, wherein among the epoxy resin represented by formula (2), the epoxy resin in which n=0 is contained in an amount of from 51.9 to 87.9% by weight, the epoxy resin in which n=1 is contained in an amount of from 8.9 to 37.4% by weight, and the epoxy resin in which n=2 is contained in an amount of from 0.2 to 7.1% by weight. ### Claim 4 (depends on 1) An epoxy resin composition (B), comprising a curing agent in an amount of from 0.01 to 1000 parts by weight relative to 100 parts by weight of the epoxy resin composition (A) according to claim 1. ### Claim 5 (depends on 2) An epoxy resin composition (B), comprising a curing agent in an amount of from 0.01 to 1000 parts by weight relative to 100 parts by weight of the epoxy resin composition (A) according to claim 2. ### Claim 6 (depends on 3) An epoxy resin composition (B), comprising a curing agent in an amount of from 0.01 to 1000 parts by weight relative to 100 parts by weight of the epoxy resin composition (A) according to claim 3. ### Claim 7 (depends on 4) The epoxy resin composition (B) according to claim 4, wherein the curing agent is at least one selected from the group consisting of a phenolic curing agent, an amine curing agent, an acid anhydride curing agent, and an amide curing agent. ### Claim 8 (depends on 5) The epoxy resin composition (B) according to claim 5, wherein the curing agent is at least one selected from the group consisting of a phenolic curing agent, an amine curing agent, an acid anhydride curing agent, and an amide curing agent. ### Claim 9 (depends on 6) The epoxy resin composition (B) according to claim 6, wherein the curing agent is at least one selected from the group consisting of a phenolic curing agent, an amine curing agent, an acid anhydride curing agent, and an amide curing agent. ### Claim 10 (depends on 4) The epoxy resin composition (B) according to claim 4, further comprising an epoxy resin which is different from the epoxy resin in the epoxy resin composition (A). ### Claim 11 (depends on 7) The epoxy resin composition (B) according to claim 7, further comprising an epoxy resin which is different from the epoxy resin in the epoxy resin composition (A). ### Claim 12 (depends on 4) A cured product obtained by curing the epoxy resin composition (B) according to claim 4. ### Claim 13 (depends on 7) A cured product obtained by curing the epoxy resin composition (B) according to claim 7. ### Claim 14 (depends on 10) A cured product obtained by curing the epoxy resin composition (B) according to claim 10. ### Claim 15 (depends on 4) An electrical or electronic component obtained by curing the epoxy resin composition (B) according to claim 4. ### Claim 16 (depends on 7) An electrical or electronic component obtained by curing the epoxy resin composition (B) according to claim 7. ### Claim 17 (depends on 10) An electrical or electronic component obtained by curing the epoxy resin composition (B) according to claim 10.