# US 11,299,448 B2 · Active ester compound > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,299,448 B2 - Document ID: US11299448B2 - Status: Granted - Kind: B2 - Application number: 16/610,582 - Filed: 2018-04-10 - Published: 2020-05-14 - Granted: 2022-04-12 - Earliest claimed: 2017-05-12 - Assignees: DIC Corporation - Applicants: DIC Corporation - Inventors: Tatsuya Okamoto; Yutaka Satou - Web page: https://patentgrep.com/patent/US11299448B2 ## CPC - C07C 65/21: containing ether groups, [IMAGE cpc-sch-C07C-0958.gif] groups,[IMAGE cpc-sch-C07C-0959.gif] groups, or[IMAGE cpc-sch-C07C-0960.gif] groups - H10W 74/47: comprising organic materials, e.g. plastics or resins - C07C 67/03: by reacting an ester group with a hydroxy group - C07C 69/78: Benzoic acid esters - C07C 69/80: Phthalic acid esters - C08G 59/423: {containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen} - C08G 63/682: containing halogens - C08L 27/12: containing fluorine atoms - C08L 67/03: the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings - H05K 1/03: Use of materials for the substrate - H05K 1/0366: {reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence)} - H10W 74/40: characterised by their materials - C08K 5/10: Esters; Ether-esters - H05K 2201/015: Fluoropolymer, e.g. polytetrafluoroethylene [PTFE] - H05K 2201/029: Woven fibrous reinforcement or textile - C07C: ACYCLIC OR CARBOCYCLIC COMPOUNDS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) ## Abstract An active ester compound that can form a cured product having excellent dielectric properties and copper foil adhesion properties is provided, a curable composition including the active ester compound is provided, and a cured product of the curable composition is provided. Also provided are a semiconductor encapsulating material, a printed wiring board, and a build-up film formed by using the curable composition. Specifically, an active ester compound is provided which includes a fluorinated hydrocarbon structural moiety and a plurality of aromatic ester structural moieties in the structure of the molecule and includes an aryloxycarbonyl structure or an arylcarbonyloxy structure at an end of the molecule, a curable composition including the active ester compound, and a cured product of the curable composition, and also provided are a semiconductor encapsulation material, a printed wiring board, and a build-up film formed by using the curable composition. ## Claims ### Claim 1 An active ester compound comprising: a fluorinated hydrocarbon structural moiety (F) and a plurality of aromatic ester structural moieties (E) in a structure of a molecule; and an aryloxycarbonyl structure (P) or an arylcarbonyloxy structure (A) at an end of the molecule, wherein the active ester compound is an esterification product of a compound (a1), a compound (a2), and a compound (a3), and at least one of the compound (a1), the compound (a2), and the compound (a3) contains the fluorinated hydrocarbon structural moiety (F) in a structure of a molecule, the compound (a1) being an aromatic monohydroxy compound, the compound (a2) being an aromatic polycarboxylic acid or an acid halide thereof (a2), the compound (a3) being a compound containing at least two phenolic hydroxyl groups in a structure of a molecule; and the ratio between the number of moles of the hydroxyl groups present in the aromatic monohydroxy compound (a1) and the number of moles of the hydroxyl groups present in the compound containing two or more phenolic hydroxyl groups in the structure of the molecule (a3) is 10:90 to 75:25. ### Claim 2 (depends on 1) The active ester compound according to claim 1, wherein the fluorinated hydrocarbon structural moiety (F) is a perfluoroalkyl group having 1 to 6 carbon atoms. ### Claim 3 (depends on 1) A curable composition comprising the active ester compound according to claim 1 and a curing agent. ### Claim 4 (depends on 1) The active ester compound according to claim 1, wherein the compound (a1) is a substituted or unsubstituted naphthol compound. ### Claim 5 (depends on 3) The curable composition according to claim 3, further comprising a poly(fluoroalkylene) resin. ### Claim 6 (depends on 5) A cured product of the curable composition according to claim 5. ### Claim 7 (depends on 5) A semiconductor encapsulating material comprising the curable composition according to claim 5. ### Claim 8 (depends on 5) A printed wiring board comprising a product of the curable composition according to claim 5. ### Claim 9 (depends on 5) A build-up film comprising a product of the curable composition according to claim 5.