# US 11,299,392 B2 · Packaging for MEMS transducers

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 11,299,392 B2
- Document ID: US11299392B2
- Status: Granted
- Kind: B2
- Application number: 16/869,075
- Filed: 2020-05-07
- Published: 2020-12-03
- Granted: 2022-04-12
- Earliest claimed: 2019-06-03
- Assignees: Cirrus Logic, Inc.
- Applicants: Cirrus Logic International Semiconductor Ltd.
- Inventors: Rkia Achehboune; Roberto Brioschi; Dimitris Drogoudis; David Patten
- Web page: https://patentgrep.com/patent/US11299392B2

## CPC

- B81B 7/0064: {for protecting against electromagnetic or electrostatic interferences}
- H04R 19/005: {using semiconductor materials}
- B81C 1/00269: {Bonding of solid lids or wafers to the substrate}
- H04R 19/04: Microphones (H04R19/01 takes precedence)
- H04R 31/00: Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)}
- B81B 2201/0257: Microphones or microspeakers
- B81B 2203/0127: Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
- B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package
- H04R 2201/003: Mems transducers or their use
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)
- H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K)
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)

## Abstract

The Application describes a substrate design for a MEMS transducer package. The substrate is defined by a conductive layer which forms the upper and lower surfaces of the substrate. The substrate is also provided with a conductive portion which is electrically isolated from the rest of the conductive layer. The conductive portion is supported between a first plane defined by the upper surface of the substrate and a second plane defined by the lower surface of the substrate by an electrically insulating moulding substance.

## Claims

### Claim 1

A MEMS transducer package comprising:
a substrate forming a package substrate of the MEMS transducer package, the substrate comprising:
a conductive layer which defines upper and lower surfaces of the substrate;
a conductive portion which is electrically isolated from the conductive layer, wherein the conductive portion is supported between a first plane defined by the upper surface of the substrate and a second plane defined by the lower surface of the substrate by an electrically insulating moulding substance;
an intermediate substrate provided on the first planar surface of the package substrate, the intermediate substrate comprising an aperture and being arranged relative to the package substrate so as to overly a hole which extends through the package substrate from the upper planar surface to the lower planar surface thereof;
a MEMS transducer provided on the upper surface of the intermediate substrate;
electronic circuitry provided on the upper surface of the intermediate substrate; and
a conductive lid structure, wherein the lid structure is mounted to the upper surface of the substrate to define an interior chamber.

### Claim 2 (depends on 1)

A MEMS transducer package as claimed in claim 1 wherein the conductive layer defines a conductive frame of the substrate.

### Claim 3 (depends on 2)

A MEMS transducer package as claimed in claim 2, wherein the conductive frame extends around the entire perimeter of the substrate.

### Claim 4 (depends on 1)

A MEMS transducer package as claimed in claim 1, wherein the moulding substance extends between the outer perimeter of the conductive portion and an inner wall of an aperture formed through the conductive layer of the substrate.

### Claim 5 (depends on 4)

A MEMS transducer package as claimed in claim 4, wherein the moulding substance defines a connecting frame.

### Claim 6 (depends on 1)

A MEMS transducer package as claimed in claim 1, comprising a plurality of conductive portions, each being electrically isolated from the conductive layer of the substrate and from each other, and wherein each conductive portion is supported between the first plane and the second plane by an electrically insulating moulding substance.

### Claim 7 (depends on 1)

A MEMS transducer package as claimed in claim 1, further comprising a hole which extends through the substrate from the upper planar surface to the lower planar surface thereof.

### Claim 8 (depends on 1)

A MEMS transducer package as claimed in claim 1, wherein the lid structure comprises a cover portion which extends over the substrate and at least one side wall.

### Claim 9 (depends on 8)

A MEMS transducer package as claimed in claim 8, wherein the conductive layer defines a conductive frame of the substrate, and wherein a terminating portion of the side wall(s) is mounted to the conductive frame of substrate.

### Claim 10 (depends on 1)

A MEMS transducer package as claimed in claim 1, wherein the MEMS transducer comprises a MEMS microphone transducer and comprises a flexible membrane which deflects in response to a pressure differential across the membrane, and wherein the MEMS microphone transducer is provided such that the flexible membrane overlies the aperture of the intermediate substrate.

### Claim 11 (depends on 1)

A MEMS transducer package as claimed in claim 1, wherein in use the package substrate and the lid structure are at ground potential.

### Claim 12 (depends on 1)

An electronic device comprising a MEMS transducer package as claimed in claim 1.

### Claim 13 (depends on 12)

An electronic device as claimed in claim 12, wherein the device is at least one of: a portable device; a battery powered device; an audio device; a computing device; a communications device; a personal media player; a headphone; a mobile telephone; a games device; and a voice controlled device.