# US 11,299,302 B2 · Integrated semiconductor die parceling platforms

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 11,299,302 B2
- Document ID: US11299302B2
- Status: Granted
- Kind: B2
- Application number: 16/442,235
- Filed: 2019-06-14
- Published: 2020-04-30
- Granted: 2022-04-12
- Earliest claimed: 2018-10-26
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Co., Ltd.
- Inventors: Tsung-Sheng Kuo; Hsu-Shui Liu; Jiun-Rong Pai; Yang-Ann Chu; Chieh-Chun Lin; Shine Chen
- Web page: https://patentgrep.com/patent/US11299302B2

## CPC

- B65B 5/045: {in bags}
- H10P 72/0611: {Sorting devices}
- G01N 21/9501: {Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)}
- G06T 7/0004: {Industrial image inspection}
- H10P 72/0456: {in-line arrangement}
- H10P 72/16: {Trays for chips}
- B65B 43/18: by suction-operated grippers
- B65G 47/28: during transit by a single conveyor
- B65B: MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING (bundling and pressing devices for cigars A24C1/44; devices for tensioning and securing binders adapted to be supported by the article or articles to be bound B25B25/00; applying closure members to bottles, jars or similar containers B67B1/00-B67B6/00; concurrent cleaning, filling and closing of bottles B67C7/00; emptying bottles, jars, cans, casks, barrels or similar containers B67C9/00)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q)
- G06T: IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- B65G: TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS (packaging B65B; handling thin or filamentary materials, e.g. paper sheets or thread, B65H; cranes B66C; portable mobile or lifting or hauling appliances, e.g. hoists, B66D; devices for lifting or lowering goods for loading or unloading purposes, e.g. fork-lift trucks, B66F9/00; emptying bottles, jars, casks, barrels or similar containers, not otherwise provided for, B67C9/00; delivering or transferring liquids B67D; filling or discharging vessels for liquefied, solidified or compressed gases F17C; pipe-line systems for fluids F17D)

## Abstract

In certain embodiments, a system includes: an inspection station configured to receive a die vessel, wherein the inspection station is configured to inspect the die vessel for defects; a desiccant station configured to receive the die vessel from the inspection station, wherein the desiccant station is configured to add a desiccant to the die vessel; a bundle station configured to receive the die vessel from the desiccant station, wherein the bundle station is configured to combine the die vessel with another die vessel as a die bundle; and a bagging station configured to receive the die bundle from the bundle station, wherein the bagging station is configured to dispose the die bundle in a die bag and to heat seal the die bag with the die bundle inside.

## Claims

### Claim 1

A system, comprising:
an inspection station configured to receive a die vessel, wherein the inspection station is configured to inspect the die vessel for defects utilizing an image sensor arranged over part of a conveyor system;
a desiccant station configured to receive the die vessel from the inspection station, wherein the desiccant station comprises at least one desiccant loader that is configured to add a desiccant to the die vessel;
a bundle station configured to receive the die vessel from the desiccant station, wherein the bundle station comprises a plurality of die vessels stacked on top of one another and configured to be secured together via a harness;
a bagging station configured to receive the die bundle from the bundle station, wherein the bagging station is configured to dispose the die bundle in a die bag and to heat seal the die bag with the die bundle inside, wherein the bagging station comprises a suction conduit configured to remove a gas from the die bag; and
a folding station configured to receive the die bag from the bagging station, wherein the folding station comprises a robotic arm configured to fold the die bag and deposit the folded die bag onto one of a plurality of shelves of an outport car, wherein the outport car transports the folded die bag from the system.

### Claim 2 (depends on 1)

The system of claim 1, wherein the inspection station, the desiccant station, the bundle station, and the bagging station are connected via the conveyor system that moves the die vessel in an automated manner.

### Claim 3 (depends on 2)

The system of claim 2, wherein the conveyor system comprises a conveyor belt.

### Claim 4 (depends on 1)

The system of claim 1, wherein the bagging station is configured to print a bar code on the die bag.

### Claim 5 (depends on 1)

The system of claim 1, wherein the outport car comprises wheels and is configured to be wheeled from the folding station.

### Claim 6 (depends on 1)

The system of claim 1, further comprising:
a buffer station configured to store die vessels received at a load port on buffer shelves, wherein the inspection station is configured to receive the die vessel from the buffer station.

### Claim 7 (depends on 1)

The system of claim 1, wherein the inspection station is configured to inspect the die vessel for a number of die and die quality.

### Claim 8 (depends on 1)

The system of claim 1, wherein the bagging station is configured to:
create a vacuum within the die bag; and
heat seal the die bag with the die bundle in a vacuum environment inside.

### Claim 9 (depends on 1)

The system of claim 1, wherein the one or more die vessels are a predetermined number of die vessels.

### Claim 10 (depends on 1)

The system of claim 1, wherein the bundle station is further configured to move the harness over the stacked one or more die vessels and then tightened the harness over the stacked one or more die vessels to cause the die vessels to adhere together.

### Claim 11 (depends on 1)

The system of claim 1, wherein each die bag is folded at the folding station so that each die bag fits within one of the respective shelves of the outport car and are separated vertically from each other.

### Claim 12 (depends on 1)

The system of claim 1, wherein if the inspection station detects a defect in the one or more die vessels, the inspection station is configured to move the one or more die vessels with the defect to a remediation location for remediation.

### Claim 13

An integrated semiconductor die parceling platform comprising:
an inspection station configured to receive a die vessel, wherein the inspection station is configured to inspect the die vessel for defects utilizing an image sensor arranged over part of a conveyor system;
a desiccant station configured to receive the die vessel from the inspection station, wherein the desiccant station comprises at least one desiccant loader that is configured to add a desiccant to the die vessel;
a bundle station configured to receive the die vessel from the desiccant station, wherein the bundle station comprises a plurality of die vessels stacked on top of one another and configured to be secured together via a harness;
a bagging station configured to receive the die bundle from the bundle station, wherein the bagging station is configured to dispose the die bundle in a die bag and to heat seal the die bag with the die bundle inside, wherein the bagging station comprises a suction conduit configured to remove a gas from the die bag; and
a folding station configured to receive the die bag from the bagging station, wherein the folding station comprises a robotic arm configured to fold the die bag and deposit the folded die bag onto one of a plurality of shelves of an outport car, wherein the outport car transports the folded die bag from the integrated semiconductor die parceling platform,
wherein each station is a stationary point for processing the one or more die vessels.

### Claim 14 (depends on 13)

The integrated semiconductor die parceling platform of claim 13, wherein the die bundle is secured via a harness, and wherein the bundle station is configured to move the harness over the stacked one or more die vessels and then tightened the harness over the stacked one or more die vessels to cause the stacked one or more die vessels to adhere together.

### Claim 15 (depends on 13)

The integrated semiconductor die parceling platform of claim 13, wherein the inspection station, the desiccant station, the bundle station, and the bagging station are connected via the conveyor system that moves the die vessel in an automated manner.

### Claim 16 (depends on 13)

The integrated semiconductor die parceling platform of claim 13, wherein the conveyor system comprises a conveyor belt.

### Claim 17 (depends on 13)

The integrated semiconductor die parceling platform of claim 13, wherein the bagging station is configured to print a bar code on the die bag.

### Claim 18 (depends on 13)

The integrated semiconductor die parceling platform of claim 13, wherein if the inspection station detects a defect in the one or more die vessels, the inspection station is configured to move the one or more die vessels with the defect to a remediation location for remediation.

### Claim 19

An outport car processing manipulator system of a die parceling platform, the system comprising:
a folding station configured to receive one or more die bags from a bagging station via a conveyer system, wherein the folding station comprises at least one robotic arm configured to:
fold each of the one or more die bags to reduce a size of the die bag in order that the die bag fits one of a number of respective shelves of an outport car; and
place each of the one or more folded die bags onto the one of the number of the respective shelves of the outport car,
wherein the outport car transports the one or more folded die bags from the die parceling platform.

### Claim 20 (depends on 19)

The outport car processing manipulator system of claim 19, wherein each of the one or more die bags are separated vertically from each other.