# US 11,298,928 B2 · Protective sheet disposing method

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- Number: US 11,298,928 B2
- Document ID: US11298928B2
- Status: Granted
- Kind: B2
- Application number: 16/375,041
- Filed: 2019-04-04
- Published: 2019-10-10
- Granted: 2022-04-12
- Earliest claimed: 2018-04-09
- Assignees: Disco Corporation
- Applicants: Disco Corporation
- Inventors: Takashi Mori; Yoshikuni Migiyama; Yuta Taniyama; Mitsuru Ikushima; Shinichi Namioka; Makoto Saito; Emiko Kawamura; Yoshinori Kakinuma; Kazuki Sugiura
- Web page: https://patentgrep.com/patent/US11298928B2

## CPC

- B32B 37/02: characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
- H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes}
- B32B 37/1292: {selectively, e.g. in stripes, in patterns (B32B37/0076 takes precedence)}
- B32B 38/0004: {Cutting, tearing or severing, e.g. bursting; Cutter details (cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence)}
- C09J 5/00: Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- H10P 52/00: Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P 72/7404: {the wafer tape being a laminate of three or more layers, e.g. including additional layers beyond a base layer and an uppermost adhesive layer}
- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- B32B 37/12: characterised by using adhesives
- B32B 2457/14: Semiconductor wafers
- C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors
- H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting}
- H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape}
- H10P 72/0448: {Apparatus for applying a liquid, a resin, an ink or the like}
- H10P 72/7412: {the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support}
- H10P 72/7416: {used during dicing or grinding}
- H10P 72/7422: {used to protect an active side of a device or wafer}
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A protective sheet disposing method of disposing a protective sheet on a top surface of a wafer in which a device region having a plurality of devices formed thereon and a peripheral surplus region surrounding the device region are formed, the protective sheet disposing method including: a first protective sheet preparing step of preparing a first protective sheet having a non-adhesive portion corresponding to the device region and an adhesive portion having an adhesive layer laid on a periphery of the non-adhesive portion; a protective sheet affixing step of affixing the first protective sheet to the peripheral surplus region; a liquid resin dropping step of dropping a liquid resin onto a region of a second protective sheet; an integrating step of integrating the first protective sheet and the second protective sheet with each other; and a cutting step of cutting the first protective sheet and the second protective sheet.

## Claims

### Claim 1

A protective sheet disposing method of disposing a protective sheet on a top surface of a wafer in which a device region and a peripheral surplus region are formed, a plurality of devices being formed on the device region, and the peripheral surplus region surrounding the device region, the protective sheet disposing method comprising:
a first protective sheet preparing step of preparing a first protective sheet having a non-adhesive portion corresponding to the device region and an adhesive portion having an adhesive layer laid on a periphery of the non-adhesive portion;
a protective sheet affixing step of positioning the wafer in an opening portion of a frame having the opening portion for housing the wafer, and positioning the first protective sheet, in a state in which the frame is not yet attached thereto, such that the non-adhesive portion of the first protective sheet is positioned one onto the device region of the wafer and the adhesive portion is positioned onto both the peripheral surplus region of the wafer and the frame;
a cassette housing step of housing the wafer disposed in the frame via the first protective sheet into a cassette;
a first table placing step of carrying out the wafer disposed in the frame via the first protective sheet from the cassette, and placing the wafer disposed in the frame via the first protective sheet onto a first table;
a laying step of laying a second protective sheet having no adhesive layer onto a second table;
a liquid resin dropping step of supporting the frame and carrying out the wafer from the first table, making the first protective sheet face the second protective sheet, and dropping a liquid resin onto a region of the second protective sheet, the region corresponding to a center of the wafer after the first table placing step and the laying step;
an integrating step of spreading the liquid resin over an entire surface corresponding to the wafer by the second protective sheet and the first protective sheet by pressing the wafer against the liquid resin via the first protective sheet, and affixing the first protective sheet to the second protective sheet and integrating the first protective sheet and the second protective sheet with each other after the liquid resin dropping step; and
a cutting step of cutting the first protective sheet and the second protective sheet along an outer circumference of the wafer after the integrating step,
wherein the affixing of the protective sheet affixing step includes a step of pressing the first protective sheet against the peripheral surplus region of the wafer and against the frame, and further wherein during at least a portion of the pressing step the first protective sheet is simultaneously pressed against both at least a portion of the peripheral surplus region of the wafer and at least a portion of the frame.

### Claim 2 (depends on 1)

The protective sheet disposing method according to claim 1, further comprising:
a center coordinate extracting step of detecting the outer circumference of the wafer placed on the first table and extracting center coordinates of the wafer,
wherein, in the cutting step, the first protective sheet and the second protective sheet are cut along the outer circumference of the wafer on a basis of the center coordinates of the wafer.

### Claim 3 (depends on 1)

The protective sheet disposing method according to claim 1,
wherein, in the liquid resin dropping step, further liquid resin is laid also onto a region of the first protective sheet, the region corresponding to the center of the wafer.

### Claim 4 (depends on 1)

The protective sheet disposing method according to claim 1,
wherein, in the integrating step, the second table is formed by a transparent body, and the liquid resin is cured by irradiating the liquid resin with ultraviolet light via the second table and the second protective sheet.

### Claim 5 (depends on 1)

The protective sheet disposing method according to claim 1,
wherein, after the cutting step, the wafer on which the first protective sheet and the second protective sheet are disposed is housed into a cassette for housing the wafer.

### Claim 6

A protective sheet disposing method of disposing a protective sheet on a top surface of a wafer in which a device region and a peripheral surplus region are formed, a plurality of devices being formed on the device region, and the peripheral surplus region surrounding the device region, the protective sheet disposing method comprising:
a preparing step of preparing the wafer disposed in a frame via a first protective sheet by positioning the wafer in an opening portion of the frame having the opening portion for housing the wafer, positioning the first protective sheet, in a state in which the frame is not yet attached thereto, by positioning a non-adhesive portion of the first protective sheet onto the device region of the wafer, the first protective sheet having the non-adhesive portion corresponding to the device region and an adhesive portion including an adhesive layer laid on a periphery of the non-adhesive portion, while also positioning the adhesive portion onto both the peripheral surplus region of the wafer and the frame, and then affixing the first protective sheet to the peripheral surplus region and the frame;
a first table placing step of placing the wafer disposed in the frame via the first protective sheet onto a first table;
a laying step of laying a second protective sheet having no adhesive layer onto a second table;
a liquid resin dropping step of supporting the frame and carrying out the wafer from the first table, making the first protective sheet face the second protective sheet, and dropping a liquid resin onto a region of the second protective sheet, the region corresponding to a center of the wafer after the first table placing step and the laying step;
an integrating step of spreading the liquid resin over an entire surface corresponding to the wafer by the second protective sheet and the first protective sheet by pressing the wafer against the liquid resin via the first protective sheet, and affixing the first protective sheet to the second protective sheet and integrating the first protective sheet and the second protective sheet with each other after the liquid resin dropping step; and
a cutting step of cutting the first protective sheet and the second protective sheet along an outer circumference of the wafer after the integrating step,
wherein the affixing of the first protective sheet to the peripheral surplus region and the frame includes a step of pressing the first protective sheet against the peripheral surplus region of the wafer and against the frame, and further wherein during at least a portion of the pressing step the first protective sheet is simultaneously pressed against both at least a portion of the peripheral surplus region of the wafer and at least a portion of the frame.

### Claim 7

A protective sheet disposing method of disposing a protective sheet on a top surface of a wafer in which a device region and a peripheral surplus region are formed, a plurality of devices being formed on the device region, and the peripheral surplus region surrounding the device region, the protective sheet disposing method comprising:
a preparing step of preparing the wafer disposed in a frame via a first protective sheet by positioning the wafer in an opening portion of the frame having the opening portion for housing the wafer, positioning the first protective sheet, in a state in which the frame is not yet attached thereto, by positioning a non-adhesive portion of the first protective sheet onto the device region of the wafer, the first protective sheet having the non-adhesive portion corresponding to the device region and an adhesive portion including an adhesive layer laid on a periphery of the non-adhesive portion, while also positioning the adhesive portion onto both the peripheral surplus region of the wafer and the frame, and then affixing the first protective sheet to the peripheral surplus region and the frame;
a first table placing step of placing the wafer disposed in the frame via the first protective sheet onto a first table;
a laying step of laying a second protective sheet having no adhesive layer onto a second table;
a liquid resin dropping step of supporting the frame and carrying out the wafer from the first table, making the first protective sheet face the second protective sheet, and dropping a liquid resin onto a region of the second protective sheet, the region corresponding to a center of the wafer, and wherein further liquid resin is laid also onto a region of the first protective sheet, the region corresponding to the center of the wafer after the first table placing step and the laying step;
an integrating step of spreading the liquid resin and the further liquid resin over an entire surface corresponding to the wafer by the second protective sheet and the first protective sheet by pressing the wafer against the liquid resin and the further liquid resin via the first protective sheet, and affixing the first protective sheet to the second protective sheet and integrating the first protective sheet and the second protective sheet with each other after the liquid resin dropping step; and
a cutting step of cutting the first protective sheet and the second protective sheet along an outer circumference of the wafer after the integrating step,
wherein the affixing of the first protective sheet to the peripheral surplus region and the frame includes a step of pressing the first protective sheet against the peripheral surplus region of the wafer and against the frame, and further wherein during at least a portion of the pressing step the first protective sheet is simultaneously pressed against both at least a portion of the peripheral surplus region of the wafer and at least a portion of the frame.

### Claim 8 (depends on 1)

The protective sheet disposing method according to claim 1, wherein the step of pressing comprises rolling a roller upon the first protective sheet.

### Claim 9 (depends on 6)

The protective sheet disposing method according to claim 6, wherein the step of pressing comprises rolling a roller upon the first protective sheet.

### Claim 10 (depends on 7)

The protective sheet disposing method according to claim 7, wherein the step of pressing comprises rolling a roller upon the first protective sheet.