# US 11,298,727 B2 · Substrate cleaning apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,298,727 B2 - Document ID: US11298727B2 - Status: Granted - Kind: B2 - Application number: 16/499,705 - Filed: 2017-03-30 - Published: 2021-06-24 - Granted: 2022-04-12 - Earliest claimed: 2017-03-30 - Assignees: ACM Research (Shanghai) Inc. - Applicants: ACM Research (Shanghai) Inc. - Inventors: Hui Wang; Jun Wu; Cheng Cheng; Xi Wang; Zhenming Chu - Web page: https://patentgrep.com/patent/US11298727B2 ## CPC - B08B 3/12: by sonic or ultrasonic vibrations - G03F 1/82: Auxiliary processes, e.g. cleaning or inspecting - H10P 72/0414: {using mainly spraying means, e.g. nozzles} - H10P 72/7608: {characterised by a plurality of separate clamping members, e.g. clamping fingers} - B08B: CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A substrate cleaning apparatus, including a chuck assembly, at least one first nozzle (107,207), and an ultra or mega sonic device (206,306). The chuck assembly is configured to receive and clamp a substrate. The at least one first nozzle (107,207) is configured to spray liquid onto the top surface of the substrate. The ultra or mega sonic device (206,306) is configured to dispose above the top surface of the substrate for providing an ultra or mega sonic cleaning to the substrate. A gap is formed between the ultra or mega sonic device (206,306) and the top surface of the substrate, and the gap is fully and continuously filled with the liquid so that the entire underneath of the ultra or mega sonic device (206,306) is filled with the liquid all the time during the cleaning process. ## Claims ### Claim 1 A substrate cleaning apparatus, comprising: a chuck assembly for receiving and clamping a substrate, the chuck assembly including a chuck having a receiving cavity for holding the substrate, the receiving cavity being surrounded by a top surface of the chuck; at least one first nozzle, spraying liquid onto a top surface of the substrate; and an ultra or mega sonic device, disposed above the top surface of the substrate and the top surface of the chuck for providing an ultra or mega sonic cleaning to the substrate, a gap formed between the ultra or mega sonic device and the top surface of the substrate and the top surface of the chuck, the gap being fully and continuously filled with the liquid so that an entire underneath of the ultra or mega sonic device being filled with the liquid all the time during the cleaning process. ### Claim 2 (depends on 1) The apparatus according to claim 1, wherein the chuck assembly further comprises: a rotating spindle, fixed with the chuck; a rotating driving mechanism, connected to the rotating spindle for driving the rotating spindle and the chuck to rotate; supporting pins, disposed in the receiving cavity of the chuck for supporting the substrate; and clamp devices, mounted on the chuck for clamping the substrate. ### Claim 3 (depends on 2) The apparatus according to claim 2, wherein the rotating spindle is hollow and fixed at the bottom of the chuck, and the bottom of the chuck defines a through-hole communicating with the receiving cavity and the rotating spindle, a second nozzle passes through the through-hole of the chuck and the rotating spindle for cleaning the bottom surface of the substrate. ### Claim 4 (depends on 3) The apparatus according to claim 3, wherein the second nozzle has at least one liquid channel extending from the bottom end to the top end of the second nozzle and penetrating the top end of the second nozzle for spraying liquid onto the bottom surface of the substrate. ### Claim 5 (depends on 4) The apparatus according to claim 4, wherein corresponding to every liquid channel, the bottom end of the second nozzle defines an inlet for supplying the liquid to the liquid channel. ### Claim 6 (depends on 2) The apparatus according to claim 2, wherein the bottom of the chuck defines a plurality of drain holes, the plurality of drain holes communicate with the receiving cavity. ### Claim 7 (depends on 6) The apparatus according to claim 6, wherein the bottom of the chuck inside the receiving cavity has a slope surface which is conductive to the liquid in the receiving cavity flowing to the drain holes. ### Claim 8 (depends on 2) The apparatus according to claim 2, wherein every clamp device has a clamp pin for clamping the substrate by means of centrifugal force. ### Claim 9 (depends on 2) The apparatus according to claim 2, wherein the opening shape of the receiving cavity matches with the shape of the substrate. ### Claim 10 (depends on 2) The apparatus according to claim 2, wherein the substrate is a mask and the opening shape of the receiving cavity is substantially square. ### Claim 11 (depends on 10) The apparatus according to claim 10, wherein there are four clamp devices mounted on the chuck and located at four corners of the receiving cavity. ### Claim 12 (depends on 11) The apparatus according to claim 11, wherein every clamp device has a clamp pin, the top end of the clamp pin defines a substantial right-angle slot for clamping the corner of the mask. ### Claim 13 (depends on 11) The apparatus according to claim 11, wherein there are four supporting pins located at the four corners of the receiving cavity and corresponding to the four clamp devices. ### Claim 14 (depends on 2) The apparatus according to claim 2, wherein the top surface of the substrate and the top surface of the chuck are on the same plane.