Back to results
US 11,294,283 B2Granted
Photosensitive resin composition, photosensitive resin laminate, and pattern forming process
AssigneeShin-Etsu Chemical Co., Ltd.
InventorYoichiro Ichioka
Life of this patent
Estimating the term…
Abstract
A photosensitive resin composition is provided comprising 100 pbw of a polyimide silicone containing a primary alcoholic hydroxyl group, a crosslinker, a photoacid generator, a polyfunctional epoxy compound, 1-70 pbw of a filler having an average particle size of 0.01-20.0 μm, and 0.01-30 pbw of a colorant. The resin composition is colored and photosensitive and cures into a product having an improved modulus.
Claims9
A photosensitive resin composition comprising:
- (A) a polyimide silicone containing 1.0×10−7 to 8.0×10−3 eq/g of primary alcoholic hydroxyl group,
- (B) a crosslinker,
- (C) a photoacid generator,
- (D) a polyfunctional epoxy compound,
- (E) a filler having an average particle size of 0.01 to 20.0 μm, in an amount of 1 to 70 parts by weight per 100 parts by weight of the polyimide silicone (A), and
- (F) a colorant in an amount of 0.01 to 30 parts by weight per 100 parts by weight of the polyimide silicone (A), wherein the colorant (F) is carbon black.
3 more elements
Dependencies are inferred from the claim text.