# US 11,287,486 B2 · 3D MEMS magnetometer and associated methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 11,287,486 B2 - Document ID: US11287486B2 - Status: Granted - Kind: B2 - Application number: 15/534,702 - Filed: 2015-12-02 - Published: 2017-12-21 - Granted: 2022-03-29 - Earliest claimed: 2014-12-09 - Assignees: Motion Engine Inc. - Applicants: Motion Engine Inc. - Inventors: Robert Mark Boysel - Web page: https://patentgrep.com/patent/US11287486B2 ## CPC - G01R 33/0286: {comprising microelectromechanical systems [MEMS] (MEMS devices in general B81B)} - G01R 33/0206: {Three-component magnetometers} - B81B 2201/02: Sensors - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) ## Abstract A micro-electro-mechanical system (MEMS) magnetometer is provided for measuring magnetic field components along three orthogonal axes. The MEMS magnetometer includes a top cap wafer, a bottom cap wafer and a MEMS wafer having opposed top and bottom sides bonded respectively to the top and bottom cap wafers. The MEMS wafer includes a frame structure and current-carrying first, second and third magnetic field transducers. The top cap, bottom cap and MEMS wafer are electrically conductive and stacked along the third axis. The top cap wafer, bottom cap wafer and frame structure together form one or more cavities enclosing the magnetic field transducers. The MEMS magnetometer further includes first, second and third electrode assemblies, the first and second electrode assemblies being formed in the top and/or bottom cap wafers. Each electrode assembly is configured to sense an output of a respective magnetic field transducer induced by a respective magnetic field component. ## Claims ### Claim 1 A three-dimensional (3D) micro-electro-mechanical system (MEMS) magnetometer for measuring first, second and third magnetic field components respectively along mutually orthogonal first, second and third axes, the 3D MEMS magnetometer comprising: a MEMS wafer having opposed top and bottom sides, the MEMS wafer comprising a silicon-on-insulator (SOI) wafer including a MEMS device layer, a MEMS handle layer and a MEMS insulating layer between the MEMS device layer and the MEMS handle layer, the MEMS wafer further comprising a frame structure and current-carrying first, second and third magnetic field transducers formed in the MEMS device layer; a top cap wafer and a bottom cap wafer respectively bonded to the top side and the bottom side of the MEMS wafer, the top cap wafer, the bottom cap wafer and the MEMS wafer being electrically conductive, the top cap wafer, the bottom cap wafer and the frame structure forming, in combination, one or more cavities, each cavity enclosing at least one of the first, second and third magnetic field transducers, each magnetic field transducer being enclosed in one of the one or more cavities; and first, second and third electrode assemblies, the first and second electrode assemblies each being formed in either, or both, of the top and bottom cap wafers, each of the first, second and third electrode assemblies being configured to sense an output of a respective one of the first, second and third magnetic field transducers induced by a respective one of the first, second and third magnetic field components. ### Claim 2 (depends on 1) The 3D MEMS magnetometer according to claim 1, wherein each of the first, second and third electrode assemblies is configured to capacitively sense a displacement of the respective one of the first, second and third magnetic field transducers in response to a Lorentz force produced by the respective one of the first, second and third magnetic field components. ### Claim 3 (depends on 2) The 3D MEMS magnetometer according to claim 2, wherein the first and second magnetic field transducers are suspended from the frame structure, configured to carry a current along the second and first axes, respectively, and deflectable along the third axis in response to the Lorentz force produced by the first and second magnetic field components, respectively. ### Claim 4 (depends on 3) The 3D MEMS magnetometer according to claim 3, wherein the first magnetic field transducer comprises a first pair of elongated transducer elements extending along the second axis, and wherein the second magnetic field transducer comprises a second pair of elongated transducer elements extending along the first axis. ### Claim 5 (depends on 4) The 3D MEMS magnetometer according to claim 4, wherein: the first pair of elongated transducer elements are configured to carry equal and opposite currents; the first electrode assembly forms a first pair of capacitors with the first pair of elongated transducer elements and is configured to measure a first differential capacitance between the first pair of capacitors, the first differential capacitance being indicative of a magnitude of the first magnetic field component; the second pair of elongated transducer elements are configured to carry equal and opposite currents; and the second electrode assembly forms a second pair of capacitors with the second pair of elongated transducer elements and is configured to measure a second differential capacitance between the second pair of capacitors, the second differential capacitance being indicative of a magnitude of the second magnetic field component. ### Claim 6 (depends on 1) The 3D MEMS magnetometer according to claim 1, wherein each of the first and second electrode assemblies comprises one or more sense electrodes, each sense electrode being laterally bordered by an insulating closed-loop trench extending along the third axis and at least partially into the either one of the top and bottom cap wafers. ### Claim 7 (depends on 1) The 3D MEMS magnetometer according to claim 1, wherein the third magnetic field transducer comprises a stationary transducer element and a movable transducer element respectively fixed and displaceable in a plane perpendicular to the third axis relative to the frame structure, the movable transducer element being configured to carry a current in said plane. ### Claim 8 (depends on 7) The 3D MEMS magnetometer according to claim 7, wherein the third electrode assembly is configured to capacitively sense a relative motion between the stationary transducer element and the movable transducer element, said relative motion being indicative of a magnitude of the third magnetic field component. ### Claim 9 (depends on 8) The 3D MEMS magnetometer according to claim 8, wherein the third electrode assembly forms an interdigitated capacitive structure comprising at least one first set of conductive digits provided on the stationary transducer element and at least one second set of conductive digits provided on the movable transducer element, the at least one first set and the at least one second set of conductive digits being interlocked and capacitively coupled with each other. ### Claim 10 (depends on 1) The 3D MEMS magnetometer according to claim 1, wherein the third electrode assembly is formed in the MEMS wafer. ### Claim 11 (depends on 10) The 3D MEMS magnetometer according to claim 10, further comprising: one or more electrical contacts formed on an outer side of the top cap wafer; and an electrically conductive path extending across and through the top cap wafer to electrically connect the one or more electrical contacts to the third electrode assembly. ### Claim 12 (depends on 1) The 3D MEMS magnetometer according to claim 1, wherein the top cap wafer, the bottom cap wafer and the MEMS wafer are each made at least partially of silicon-based material. ### Claim 13 (depends on 1) The 3D MEMS magnetometer according to claim 1, wherein the MEMS device layer is bonded to the top cap wafer, the MEMS handle layer is bonded to the bottom cap wafer in the frame structure, and wherein each magnetic field transducer is positioned over a cavity formed in the MEMS handle layer and the MEMS insulating layer. ### Claim 14 (depends on 1) The 3D MEMS magnetometer according to claim 1, wherein at least one of the top cap wafer and the bottom cap wafer is a silicon-on-insulator wafer including a cap device layer, a cap handle layer, and a cap insulating layer interposed therebetween. ### Claim 15 (depends on 1) The 3D MEMS magnetometer according to claim 1, wherein at least one of the one or more cavities is a hermetically sealed vacuum cavity. ### Claim 16 (depends on 1) The 3D MEMS magnetometer according to claim 1, wherein the one or more cavities consist of a single cavity enclosing the first, second and third magnetic field transducers. ### Claim 17 (depends on 1) The 3D MEMS magnetometer according to claim 1, wherein the first, second and third magnetic field transducers form respective first, second and third resonant structures having associated resonant frequencies, each of the first, second and third magnetic field transducers configured to carry current at a frequency matching the resonant frequency associated thereto. ### Claim 18 A 3D MEMS magnetometer for measuring first, second and third magnetic field components respectively along mutually orthogonal first, second and third axes, the 3D MEMS magnetometer comprising: a MEMS wafer having opposed top and bottom sides, the MEMS wafer comprising a frame structure and current-carrying first, second and third magnetic field transducers, the MEMS wafer being a silicon-on-insulator (SOI) wafer with a MEMS device layer, a MEMS handle layer, and a MEMS insulating layer interposed between the MEMS device layer and the MEMS handle layer, the first, second and third magnetic field transducers being formed in the MEMS device layer such that each magnetic field transducer is separated from the MEMS insulating layer; a top cap wafer and a bottom cap wafer respectively bonded to the MEMS device layer and the MEMS handle layer, the top cap wafer, the bottom cap wafer and the MEMS wafer being electrically conductive, the top cap wafer, the bottom cap wafer and the frame structure forming, in combination, one or more cavities, each cavity enclosing at least one of the first, second and third magnetic field transducers, each magnetic field transducer being enclosed in one of the one or more cavities; and first, second and third electrode assemblies, the first and second electrode assemblies each being formed in the top cap wafer, each of the first, second and third electrode assemblies being configured to sense an output of a respective one of the first, second and third magnetic field transducers induced by a respective one of the first, second and third magnetic field components. ### Claim 19 (depends on 18) The 3D MEMS magnetometer according to claim 18, wherein the top cap SOI wafer comprising a top cap device layer bonded to the MEMS device layer, a top cap handle layer, and a top cap insulating layer interposed between the top cap device layer and the top cap handle layer. ### Claim 20 (depends on 19) The 3D MEMS magnetometer according to claim 19, wherein each of the first and second electrode assemblies is etched in the top cap device layer. ### Claim 21 (depends on 20) The 3D MEMS magnetometer according to claim 20, wherein the top cap wafer includes recesses formed therein, and the recesses defining capacitor gaps between the first electrode assembly and the first magnetic field transducer, and between the second electrode assembly and the second magnetic field transducer. ### Claim 22 (depends on 21) The 3D MEMS magnetometer according to claim 21, further comprising: at least one first electrical contact formed on an outer side of the top cap handle layer, and a first electrically conductive path extending across and successively through the top cap handle, insulating and device layers to electrically connect the at least one first electrical contact to the first electrode assembly; and at least one second electrical contact formed on an outer side of the top cap handle layer, and a second electrically conductive path extending across and successively through the top cap handle, insulating and device layers and to electrically connect the at least one second electrical contact to the second electrode assembly. ### Claim 23 (depends on 18) The 3D MEMS magnetometer according to claim 18, wherein the third electrode assembly is formed in the MEMS device layer. ### Claim 24 (depends on 22) The 3D MEMS magnetometer according to claim 22, further comprising: at least one third electrical contact formed on an outer side of the top cap wafer; and a third electrically conductive path extending across and through the top cap wafer to electrically connect the at least one third electrical contacts to the third electrode assembly. ### Claim 25 (depends on 18) The 3D MEMS magnetometer according to claim 18, wherein each of the first, second and third electrode assemblies is configured to capacitively sense a displacement of the respective one of the first, second and third magnetic field transducers in response to a Lorentz force produced by the respective one of the first, second and third magnetic field components. ### Claim 26 (depends on 25) The 3D MEMS magnetometer according to claim 25, wherein the first and second magnetic field transducers are suspended from the frame structure, configured to carry a current along the second and first axes, respectively, and deflectable along the third axis in response to the Lorentz force produced by the first and second magnetic field components, respectively. ### Claim 27 (depends on 26) The 3D MEMS magnetometer according to claim 26, wherein the first magnetic field transducer comprises a first pair of elongated transducer elements extending along the second axis, and wherein the second magnetic field transducer comprises a second pair of elongated transducer elements extending along the first axis. ### Claim 28 (depends on 27) The 3D MEMS magnetometer according to claim 27, wherein: the first pair of elongated transducer elements are configured to carry equal and opposite currents; the first electrode assembly forms a first pair of capacitors with the first pair of elongated transducer elements and is configured to measure a first differential capacitance between the first pair of capacitors, the first differential capacitance being indicative of a magnitude of the first magnetic field component; the second pair of elongated transducer elements are configured to carry equal and opposite currents; and the second electrode assembly forms a second pair of capacitors with the second pair of elongated transducer elements and is configured to measure a second differential capacitance between the second pair of capacitors, the second differential capacitance being indicative of a magnitude of the second magnetic field component. ### Claim 29 (depends on 18) The 3D MEMS magnetometer according to claim 18, wherein each of the first and second electrode assemblies comprises one or more sense electrodes, each sense electrode being laterally bordered by an insulating closed-loop trench extending along the third axis and at least partially into the top cap wafer. ### Claim 30 (depends on 18) The 3D MEMS magnetometer according to claim 18, wherein the third magnetic field transducer comprises a stationary transducer element and a movable transducer element respectively fixed and displaceable in a plane perpendicular to the third axis, the movable transducer element being configured to carry a current along at said plane. ### Claim 31 (depends on 30) The 3D MEMS magnetometer according to claim 30, wherein the third electrode assembly is configured to capacitively sense a relative motion between the stationary transducer element and the movable transducer element, said relative motion being indicative of a magnitude of the third magnetic field component. ### Claim 32 (depends on 31) The 3D MEMS magnetometer according to claim 31, wherein the third electrode assembly forms an interdigitated capacitive structure comprising at least one first set of conductive digits provided on the stationary transducer element and at least one second set of conductive digits provided on the movable transducer element, the at least one first set and the at least one second set of conductive digits being interlocked and capacitively coupled with each other. ### Claim 33 (depends on 18) The 3D MEMS magnetometer according to claim 18, wherein at least one of the one or more cavities is a hermetically sealed vacuum cavity. ### Claim 34 (depends on 18) The 3D MEMS magnetometer according to claim 18, wherein the one or more cavities comprises a single cavity enclosing the first, second and third magnetic field transducers. ### Claim 35 A method for measuring first, second and third magnetic field components along mutually orthogonal first, second and third axes, respectively, the method comprising: operating a three-dimensional (3D) micro-electro-mechanical system (MEMS) magnetometer comprising a silicon-on-insulator (SOI) MEMS wafer having opposed top and bottom sides, the SOI MEMS wafer including a MEMS device layer, a MEMS handle layer and an insulating layer between the MEMS device layer and the MEMS handle layer, the SOI MEMS wafer further comprising a frame structure and current-carrying first, second and third magnetic field transducers, a top cap wafer and a bottom cap wafer respectively bonded to the top side and the bottom side of the MEMS wafer, the top cap wafer, the bottom cap wafer and the MEMS wafer being electrically conductive, the top cap wafer, the bottom cap wafer and the frame structure forming, in combination, one or more cavities, each cavity enclosing at least one of the first, second and third magnetic field transducers, each magnetic field transducer being enclosed in one of the one or more cavities; flowing current into each of the first, second and third magnetic field transducers; and sensing an output of each the first, second and third magnetic field transducers induced by and indicative of a respective one of the first, second and third magnetic field components. ### Claim 36 (depends on 35) The method according to claim 35, comprising: flowing a first current into the first magnetic field transducer, the first magnetic field transducer being deflectable along the third axis and configured to carry the first current along the second axis; sensing, as a first capacitance, a deflection of the first magnetic field transducer along the third axis in response to a first Lorentz force resulting from an interaction between the first current and the first magnetic field component, the first capacitance being indicative of a magnitude of the first magnetic field component; flowing a second current into the second magnetic field transducer, the second magnetic field transducer being deflectable along the third axis and configured to carry the second current along the first axis; sensing, as a second capacitance, a deflection of the second magnetic field transducer along the third axis in response to a second Lorentz force resulting from an interaction between the second current and the second magnetic field component, the second capacitance being indicative of a magnitude of the second magnetic field component; flowing a third current into a movable transducer element of the third magnetic field transducer, the movable transducer element being displaceable relative to a stationary transducer element of the third magnetic field transducer and configured to carry the third current in a plane perpendicular to the third axis; and sensing, as a third capacitance, a relative motion between the stationary and movable transducing elements in said plane, the third capacitance being indicative of a magnitude of the third magnetic field component. ### Claim 37 (depends on 35) The method according to claim 35, further comprising sensing a magnetic field with the first and second magnetic field transducers are coupled to the frame structure, and configured to carry a current along the second and first axes, respectively, and deflectable along the third axis in response to a Lorentz force produced by the first and second magnetic field components. ### Claim 38 (depends on 35) The method according to claim 35, further comprising sensing a magnetic field with the first magnetic field transducer that comprises a first pair of elongated transducer elements extending along the second axis, and with the second magnetic field transducer that comprises a second pair of elongated transducer elements extending along the first axis.