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AssigneeLord Corporation
InventorsBrian Carney, Douglas Mowrey, Paul Wheeler, Rebecca Cowles, Tarek Agag, Brian Perry, Andrew Heidenreich, Dodik Kurniawan, Jerry Phelps
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A curable adhesive that is particularly well suited for use in an injection or compression molding operation. The adhesive is based on polymeric resins having carboxylic acid and acrylate ester functionality, such as grafted phenoxy resin, and further constituents such as organic carbonates, blocked isocyanates, catalysts, maleimide compounds, hydride sources, and a carrier fluid. The curable adhesives are particularly well suited for bonding liquid injectable substrates such as liquid silicone rubber, or polyamides to rigid substrates, such as aluminum, stainless steel, or glass.
A curable adhesive comprising a grafted phenoxy resin, an organic carbonate, and a solvent, wherein the grafted phenoxy resin comprises carboxylic acid and acrylate ester functionality.
The bonded assembly of 28, wherein the peroxide cured elastomer comprises at least one of hydrogenated nitrile butadiene rubber (HNBR), fluoroelastomers (FKM), or fluorosilicones (FVMQ).
A method of bonding two dissimilar materials in an injection or compression molding process comprising:
A method of preparing an adhesive comprising:
Dependencies are inferred from the claim text.