Die for a printhead

A die for a printhead, comprising:

• a plurality of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die;
• a plurality of fluidic actuators, proximate to the plurality of fluid feed holes, to eject fluid received from the fluid feed holes;
• a plurality of field-effect transistors, wherein each of the plurality of fluidic actuators is powered by an associated field-effect transistor;
• and
• logic circuitry to actuate the plurality of field-effect transistors on the die on an opposite side of the fluid feed holes from the plurality of field-effect transistors, wherein traces, disposed between the fluid feed holes, electrically couple the logic circuitry to the plurality of field-effect transistors;
• and
• wherein the die has a repeating structure comprising one fluid feed hole, two fluidic actuators, and two field-effect transistors placed at an interval of two times a dot pitch in a line along the die.

A method for forming a die for a printhead, comprising:

• etching a plurality of fluid feed holes in a line parallel to a longitudinal axis of a substrate;
• forming a plurality of layers on the substrate, wherein the layers comprise:
• logic power circuits along one edge of the substrate, comprising a common logic power line and a common logic ground line;
• address line circuits;
• address logic circuits, comprising address logic for selecting a fluidic actuator from a group of fluidic actuators;
• memory circuits, comprising a memory element for each group of fluidic actuators;
• printing power circuits, comprising a power circuit to power a thermal resistor for each of a plurality of fluidic actuators, and wherein layers are formed on the substrate between the plurality of fluid feed holes to electrically couple the address logic to the power circuit;
• and
• printing power connections, comprising a shared power bus and a shared common ground for the printing power circuits;
• and
• wherein the die has a repeating structure comprising one fluid feed hole, two fluidic actuators, and two field-effect transistors placed at an interval of two times a dot pitch in a line along the substrate.