System and method for compensating for thermal expansion caused by soldering process

An information handling system, comprising:

• a processor;
• a first component;
• a second component;
• and
• a memory medium coupled to the processor that includes instructions executed by the processor causing the information handling system to:
• identify a first coefficient of thermal expansion (CTE) for a first material of the first component, the first component including a plurality of component pins having a first pitch value;
• identify a second CTE for a second material of the second component, the second component associated with a plurality of electrically conductive pads;
• determine a relative expansion value based on the first CTE and the second CTE;
• determine a change in temperature value of the first component and the second component, the change in temperature value indicating a change in temperature caused by the soldering process;
• and
• determine a second pitch value for the plurality of electrically conductive pads based on a product of the relative expansion value, the first pitch value, and the change in temperature value, the second pitch value causing an alignment between the plurality of component pins and the plurality of electrically conductive pads during the soldering process.

A computer-readable non-transitory memory medium that includes instructions executed by a processor of an information handling system causing the information handling system to:

• identify a first coefficient of thermal expansion (CTE) for a first material of a first component, the first component including a plurality of component pins having a first pitch value;
• identify a second CTE for a second material of a second component, the second component associated with a plurality of electrically conductive pads;
• determine a relative expansion value based on the first CTE and the second CTE;
• determine a change in temperature value of the first component and the second component, the change in temperature value indicating a change in temperature caused by the soldering process;
• and
• determine a second pitch value for the plurality of electrically conductive pads based on a product of the relative expansion value, the first pitch value, and the change in temperature value, the second pitch value causing an alignment between the plurality of component pins and the plurality of electrically conductive pads during the soldering process.