Workpiece conveyance apparatus, semiconductor manufacturing apparatus, and workpiece conveyance method

A workpiece conveyance apparatus for conveying a workpiece, the workpiece conveyance apparatus comprising:

• a conveyance path;
• a gas flotation section that gas-floats the workpiece over the conveyance path;
• a movable holding section that holds the workpiece floated by the gas flotation section to move on the conveyance path along with the workpiece;
• a treatment region conveyance path that is located on the conveyance path, and includes a treatment region where predetermined treatment for the workpiece is performed;
• and
• a controller,
• wherein:
• the movable holding section comprises at least two holding sections along a movement direction of the conveyance path,
• each of the holding sections is capable of switching between release of holding and holding the workpiece during movement of the workpiece,
• each of the holding sections is capable of changing a holding force by which the holding section holds the workpiece, and
• the controller individually controls the holding sections to hold the workpiece by a usual holding force, thereafter to reduce the holding force thereof from the usual holding force while continuing to hold the workpiece before reaching the treatment region conveyance path, then to release holding of the workpiece on passing the treatment region conveyance path, then to restart holding of the workpiece at a reduced holding force with respect to the usual holding force after passing the treatment region conveyance path, thereafter to increase the holding force from the reduced holding force to the usual holding force, and thereafter to hold the workpiece by the usual holding force.