Substrate processing method and substrate processing apparatus

A substrate processing method comprising:

• a processing liquid supplying step of supplying a processing liquid which has a solute and a solvent to a front surface of a substrate;
• a processing film forming step of solidifying or curing the processing liquid supplied to the front surface of the substrate to form on the front surface of the substrate a processing film which holds a removal object present on the front surface of the substrate;
• and
• a peeling step of supplying a peeling liquid to the front surface of the substrate to peel the processing film from the front surface of the substrate together with the removal object,
• wherein the solute of the processing liquid has a first component and a second component which is lower in solubility in the peeling liquid than the first component,
• the processing film forming step includes a step of forming the processing film which has a first solid formed by the first component and a second solid formed by the second component, the first solid locally presented in the processing film, and
• the peeling step includes a dissolving step of dissolving the first solid in the processing film with the peeling liquid so as to partly dissolve the processing film.