Sputtering system and method
AssigneeAgency for Science, Technology and Research
InventorsJianwei Chai, Shijie Wang, Dongzhi Chi, Ming Yang
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Abstract
A sputtering system and a sputtering method are provided. The sputtering system includes a first electrode, a magnet and a second electrode. The first electrode is an elongated tube having a first end and a second end downstream of the first end. The first end is configured to receive a gas flow and the second end is placed next to a substrate. The magnet surrounds at least a portion of the elongated tube and is configured to generate a magnetic field in a space within the elongated tube. The second electrode is disposed within the elongated tube. A voltage is configured to be applied between the first and second electrodes to generate an electric field between the first and second electrodes.
Claims13
A sputtering system comprising:
- a first electrode comprising an elongated tube having a first end and a second end downstream of the first end, wherein the first end is configured to receive a gas flow and the second end is placed next to a substrate;
- a magnet surrounding at least a portion of the elongated tube and configured to generate a magnetic field in a space within the elongated tube;
- and
- a second electrode disposed within the elongated tube, wherein the first and second electrodes are made of different materials,
- wherein a voltage is configured to be applied between the first and second electrodes to generate an electric field between the first and second electrodes;
- and
- wherein a direction of the electric field between the first and second electrodes is alternated in use for depositing alternating layers of sputtered materials onto the substrate, the sputtered materials comprising the different materials.
A sputtering method comprising:
- providing a sputtering system, the system comprising:
- a first electrode comprising an elongated tube having a first end and a second end downstream of the first end, wherein the second end is disposed adjacent a substrate;
- a magnet surrounding at least a portion of the elongated tube;
- and
- a second electrode disposed within the elongated tube, wherein the first and second electrodes are made of different materials;
- generating a sputtered material, wherein generating comprises:
- generating a magnetic field in a space within the elongated tube using the magnet;
- applying a voltage between the first and second electrodes to generate an electric field between the first and second electrodes;
- and
- supplying a gas flow to the first end of the elongated tube to generate a discharge;
- depositing the generated sputtered material exiting the second end of the elongated tube onto the substrate;
- and
- alternating a direction of the electric field between the first and second electrodes for depositing alternating layers of sputtered materials onto the substrate, the sputtered materials comprising the different materials.
Dependencies are inferred from the claim text.