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US 11,253,921 B2Granted
Copper fine particle, method for producing same, and sintered body
AssigneeTaiyo Nippon Sanso Corporation
InventorsYuji Sakuramoto, Hiroshi Igarashi, Takayuki Fujimoto
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Abstract
An object of the present invention to provide copper fine particles which can be sintered at a lower temperature than that of the conventional copper fine particles without causing a cost increase, a decrease in productivity, a method for producing the copper fine particles, and a sintered body, and the present invention provides copper fine particles having a coating film containing cuprous oxide and copper carbonate on the surface thereof.
Claims7
Copper particles having a coating film on the surface thereof,
- wherein a ratio (C/SSA) of a mass fraction of carbon to a specific surface area of the copper particles is in a range of 0.008% by mass·g/m2 to 0.020% by mass·g/m2,
- wherein the copper particles are capable of being sintered in a temperature range of 120° C. to 150° C., and
- wherein the coating film consists essentially of cuprous oxide and copper carbonate.
Dependencies are inferred from the claim text.