Plating adhesion amount control mechanism and method for controlling an adhesion amount by comparing a plating adhesion amount estimation value at an upstream position and a plating adhesion actual amount at a downstream position
AssigneePrimetals Technologies Japan, Ltd.
InventorsTakashi Yonekura, Masao Tambara, Masashi Yoshikawa, Shinya Kanemori, Kazuki Yoshida
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