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US 11,248,145 B2Granted
Structural adhesives
AssigneeZephyros, Inc.
InventorMichael Czaplicki
Life of this patent
Estimating the term…
Abstract
An adhesive formulation comprising i) an adduct of an epoxy resin and an elastomer, ii) a phenoxy resin; iii) a core/shell polymer; iv) a curing agent which provides a structural adhesive with improved low temperature impact strength particularly useful for bonding metal especially in the automotive industry.
Claims21
An adhesive formulation comprising:
- i) an adduct of an epoxy resin and an elastomer, wherein the adhesive formulation contains from about 7% to about 20% by weight of the adduct based on the adhesive formulation;
- ii) a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product;
- iii) a core/shell polymer, wherein the adhesive formulation contains from 5% to 30% by weight of the core/shell polymer;
- iv) a curing agent;
- and
- v) one or more additional epoxy resins;
- wherein the adhesive formulation includes between about 55% by weight and about 70% by weight total epoxy resin, wherein the total epoxy resin is the liquid epoxy resin of the phenoxy epoxy hybrid resin and the one or more additional epoxy resins;
- wherein the adhesive formulation is a liquid or a paste at room temperature;
- wherein the adhesive formulation contains between 3% to 10% by weight of the phenoxy resin so that the adhesive formulation is pumpable;
- wherein the adhesive formulation functions over a temperature range of about −40° C. to about 90° C.;
- and
- wherein the adhesive formulation has a strength when cured in the wedge impact test at −40° C. of greater than 20 N/mm.
9 more elements
An adhesive formulation comprising:
- i) an adduct of an epoxy resin and an elastomer, wherein the formulation contains from about 7% to about 15% by weight of the adduct based on the adhesive formulation, and wherein the adduct includes about 1:5 to 5:1 parts of epoxy to elastomer;
- ii) a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product;
- iii) a core/shell polymer, wherein the adhesive formulation contains from 5% to 30% by weight of the core/shell polymer;
- iv) a curing agent;
- and
- v) one or more additional epoxy resins;
- wherein the adhesive formulation includes between about 55% by weight and about 70% by weight total epoxy resin, wherein the total epoxy resin is the liquid epoxy resin of the phenoxy epoxy hybrid resin and the one or more additional epoxy resins;
- wherein the adhesive formulation is a liquid or a paste at room temperature;
- wherein the adhesive formulation contains between 3% to 10% by weight of the phenoxy resin so that the adhesive formulation is pumpable;
- wherein the adhesive formulation functions over a temperature range of about −40° C. to about 90° C.;
- and
- wherein the adhesive formulation has a strength when cured in the wedge impact test at −40° C. of greater than 20 N/mm.
9 more elements
Dependencies are inferred from the claim text.