Hard-mask forming composition and method for manufacturing electronic component
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsKeiichi Ibata, Ryoji Watanabe
Life of this patent
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Abstract
A hard-mask forming composition, which is used for forming a hard mask used in lithography, including a first resin and a second resin, in which an amount of carbon contained in the first resin is 85% by mass or more with respect to the total mass of all elements constituting the first resin, and the amount of carbon contained in the second resin is 70% by mass or more with respect to the total mass of all elements constituting the second resin and less than the amount of carbon contained in the first resin.
Claims6
A hard-mask forming composition, which is used for forming a hard mask used in lithography, comprising:
- a first resin;
- and
- a second resin,
- wherein an amount of carbon contained in the first resin is 85% by mass or more with respect to the total mass of all elements constituting the first resin,
- an amount of carbon contained in the second resin is 70% by mass or more with respect to the total mass of all elements constituting the second resin and less than the amount of carbon contained in the first resin, and
- the first resin contains a resin having a structural unit (u11) represented by the following general formula (u11-1) and a structural unit (u12) represented by the following general formula (u12-1):
- wherein R11 is a hydrocarbon group having 1 to 20 carbon atoms which may have a substituent, or a hydrogen atom, and R12 is an aromatic hydrocarbon group having 6 to 30 carbon atoms which may have a substituent.
Dependencies are inferred from the claim text.