Molding die and compression molding Method

A molding die comprising a plurality of die portions that form a cavity in which a molded body is molded, the molding die comprising:

• a first temperature adjusting unit disposed in the vicinity of a cavity surface, the first temperature adjusting unit being capable of at least cooling the cavity surface;
• and
• a second temperature adjusting unit disposed on a side of the first temperature adjusting unit opposite from the cavity surface, the second temperature adjusting unit being capable of at least heating the cavity surface,
• wherein a distance L0 from the cavity surface to the first temperature adjusting unit and a distance L1 from the cavity surface to a surface of the corresponding die portion opposite from the cavity surface satisfy the following relationship:
• (L1/L0)>3;
• wherein:
• each die portion comprises a first section including the first temperature adjusting unit, and a second section including the second temperature adjusting unit,
• a volume V(I) of the first section of the die portion and a volume V0 of the die portion satisfy the following relationship:
• 1.3<(V0/V(I))<3;
• and
• a material forming the first section has a thermal conductivity C(I) (J/s·m·K) that is 3.5 times or more a thermal conductivity C(II) (J/s·m·K) of a material forming the second section, and/or the material forming the first section has a thermal diffusivity (m2/s) that is 3.5 times or more a thermal diffusivity (m2/s) of the material forming the second section.