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US 11,240,950 B2Granted
Component mounting apparatus
AssigneeYamaha Hatsudoki Kabushiki Kaisha
InventorKunimune Komaike
Life of this patent
Estimating the term…
Abstract
The image including both of the component and the nozzle that is being lowered toward the component is captured. The target height at which the nozzle is stopped in the mounting process is controlled based on this image. This enables the target height at the time of lowering the nozzle toward the component to be controlled regardless of a flow rate of air sucked from the nozzle.
Claims19
A component mounting apparatus, comprising:
- a board holder configured to hold a board;
- a component supplier configured to supply components stored in storage recesses;
- a mounting head configured to perform a mounting process of mounting the component on the board after stopping a nozzle being lowered toward the component at a target height and sucking the component by the nozzle in contact with the component at the target height;
- an imager configured to capture an image including both of the component or the storage recess and the nozzle being lowered toward the component;
- and
- a controller configured to control the target height, at which the nozzle is stopped in the mounting process, based on the image captured by the imager.
3 more elements
A nozzle height control method, comprising:
- capturing an image including both of a component or a storage recess storing the component and a nozzle being lowered toward the component;
- and
- performing a mounting process of mounting the component on a board after stopping the nozzle lowered toward the component at a target height and sucking the component by the nozzle in contact with the component at the target height, such that the target height at which the nozzle is stopped in the mounting process, is controlled based on the image.
Dependencies are inferred from the claim text.