Back to results
US 11,240,947 B2Granted
Carrier tape system and components and methods of use
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSung-Sheng Chiu, Pei-Haw Tsao, Tsui-Mei Chen, Shih-Hsing Lin, Li-Huan Chu
Life of this patent
Estimating the term…
Abstract
The current disclosure describes carrier tape systems, which include a cover tape having adhesion areas and non-adhesion areas which are substantially free of adhesive. Methods for supplying semiconductor devices to an apparatus, which in operation, places the semiconductor devices at desired locations are also described. Methods of forming a semiconductor device carrier system are also described.
Claims18
A method of forming a semiconductor device carrier system comprising:
- providing a carrier tape including a plurality of pockets, each pocket including an opening through which a semiconductor device passes when the semiconductor device is placed in a pocket;
- placing a semiconductor device in each of the plurality of pockets;
- providing a cover tape including a cover tape base material and an adhesive layer on the cover tape base material, the adhesive layer providing a plurality of adhesion areas including adhesive on the cover tape base material and a plurality of non-adhesion areas substantially free of adhesive on the cover tape base material, wherein each of the plurality of non-adhesion areas include a covering portion of the cover tape base material that are spaced from each other along a length of the cover tape base material and corresponds to a portion of the cover tape that covers an opening of a pocket of the plurality of pockets;
- aligning the plurality of non-adhesion areas of the cover tape respectively with the respective openings of the plurality of pockets;
- and
- attaching the carrier tape to the cover tape base material at the plurality of adhesion areas such that the adhesion areas are attached around the plurality of pockets and the semiconductor devices are retained within the plurality of pockets by the covering portions of the cover tape with the plurality of non-adhesion areas facing the semiconductor devices.
3 more elements
A method for supplying semiconductor devices to an apparatus, which in operation, places the semiconductor devices at desired locations, the method comprising:
- providing a carrier tape including a plurality of pockets each including an opening and a semiconductor device;
- providing a cover tape including a cover tape base material and an adhesive layer on the cover tape base material, the adhesive layer providing a plurality of adhesion areas including adhesive on the cover tape base material and a plurality of non-adhesion areas substantially free of adhesive on the cover tape base material, wherein each of the plurality of non-adhesion areas include a covering portion of the cover tape base material that are spaced from each other along a length of the cover tape base material and corresponds to a portion of the cover tape that covers the opening of a pocket of the plurality of pockets;
- aligning the plurality of non-adhesion areas of the cover tape respectively with the respective openings of the plurality of pockets;
- adhering the cover tape to the carrier tape at the plurality of adhesion areas such that the adhesion areas are adhered around the plurality of pockets and the plurality of semiconductor devices are retained within the plurality of pockets by the covering portions of the cover tape with the non-adhesion areas facing the plurality of semiconductor devices;
- separating, from the carrier tape the adhesion areas of the cover tape adhered to the carrier tape around the plurality of pockets;
- and
- separating, from the carrier tape, the covering portion of the cover tape which prior to the separation is directly over the opening of the pocket of the plurality of pockets, the covering portion being substantially free of adhesive.
4 more elements
A method of packaging semiconductor devices in a carrier tape, the method comprising:
- providing a carrier tape including a plurality of pockets each including an opening and a semiconductor device;
- providing a cover tape including a cover tape base material and an adhesive layer on the cover tape base material, the adhesive layer providing a plurality of adhesion areas including adhesive on the cover tape base material and a plurality of non-adhesion areas substantially free of adhesive on the cover tape base material, wherein each of the plurality of non-adhesion areas include a covering portion of the cover tape base material that are spaced from each other along a length of the cover tape base material and corresponds to a portion of the cover tape that covers the opening of a pocket of the plurality of pockets;
- aligning the plurality of non-adhesion areas of the cover tape respectively with the respective openings of the plurality of pockets;
- and
- adhering the cover tape to the carrier tape at the plurality of adhesion areas such that the adhesion areas are adhered around the plurality of pockets and the plurality of semiconductor devices are retained within the plurality of pockets by the covering portions of the cover tape with the non-adhesion areas facing the plurality of semiconductor devices.
2 more elements
Dependencies are inferred from the claim text.