Electronic device, method and apparatus for producing an electronic device, and composition therefor

A method of producing an electronic device including the steps of:

• applying an adhesive material in a first pattern on a surface of a first substrate, wherein the adhesive material is electrically conductive;
• and
• applying a metal on top of the adhesive material to secure the metal to the first substrate, wherein applying the metal comprises:
• bringing a second substrate having a metal foil disposed thereon proximate to the first substrate such that a portion of the metal foil contacts the adhesive material;
• activating the adhesive material using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material;
• separating the first substrate and the second substrate, whereby the portion of the metal foil is transferred from the second substrate to the first substrate, wherein the applied heat of the activating step heats the adhesive material from approximately 60 degrees Celsius to approximately 160 degrees Celsius and wherein the applied pressure of the activating step is from about 10 psi to about 25 psi;
• wherein the metal comprises a conductive trace of an electronic circuit, and wherein the viscosity of the adhesive material of the adhesive applying step is between about 1,000 and about 3,000 mPa-s.