Method for manufacturing multilayer wiring board

A method for manufacturing a multilayer wiring board, said method comprising steps of:

• preparing a plurality of printed wiring boards having both electrical connection pads for establishing an electrical connection between the printed wiring boards and non-connection pads for not establishing an electrical connection between the printed wiring boards on a same plane, wherein at least one of the plurality of printed wiring boards includes a through-hole covered by a metal layer to form at least one of the electrical connection pads;
• and
• overlaying the plurality of printed wiring boards so that the electrical connection pads face each other, and laminating the plurality of printed wiring boards so that the printed wiring boards are bonded to each other through a conductive paste provided between the facing electrical connection pads,
• wherein the preparing further comprises:
• attaching an insulating film to at least one of surfaces faced when the plurality of printed wiring boards are overlaid in the overlaying;
• boring holes in the insulating film in positions corresponding to the at least one electrical connection pad on the surface having the attached insulating film so that the electrical connection pad is exposed;
• and providing a conductive paste in the holes bored in the insulating film.