Flexible substrate and method for manufacturing same, and flexible electronic device

A flexible electronic device, comprising a flexible substrate;

• wherein the flexible substrate comprises:
• a flexible base;
• a plurality of electronic components disposed on the flexible base, a first gap being formed between each two adjacent electronic components of the plurality of electronic components;
• and
• a plurality of metal lines, wherein at least one end of each of the metal lines is connected to the corresponding electronic component, at least a portion of the plurality of metal lines are disposed in the first gap, and a length of each metal line disposed in the first gap is greater than a width of the first gap in an extension direction of the metal line;
• wherein a first filling layer is disposed in the first gap to wrap the metal line disposed in the first gap;
• and
• the flexible substrate further comprises a protective cover, the protective cover is disposed on one side of the electronic component distal from the flexible base by an adhesive layer, and a second gap is between the first filling layer and the adhesive layer.

A method for manufacturing a flexible substrate, comprising:

• disposing a plurality of electronic components on the flexible base, a first gap being formed between each two adjacent electronic components of the plurality of electronic components;
• disposing a plurality of metal lines on the flexible base, and stretching and restoring the flexible base, such that the length of each metal line disposed in the first gap is greater than the width of the first gap in an extension direction of the metal line;
• disposing a first filling layer in the first gap to wrap the metal line in the first gap;
• controlling a height of the first filling layer, such that the first filling layer is lower than the electronic component corresponding to the first gap in a direction perpendicular to the flexible base, such that a groove is formed in the first gap;
• and
• disposing a protective cover on one side of the electronic component distal from the base, wherein the protective cover is attached to the electronic component by an adhesive layer, such that a second gap is formed at the groove.