Heat dissipation structure and electronic device
AssigneesFu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
InventorCheng-Xiang Liu
Life of this patent
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Abstract
A heat dissipation structure applied to an electronic device includes a circuit board assembly, a pipe, a refrigerant fluid, and a water pump. The circuit board assembly is provided with a receiving chamber therein, an inlet, and an outlet. Each of the inlet and the outlet communicates with the receiving chamber. The pipe and the receiving chamber together form a liquid channel. The refrigerant fluid is received in the liquid channel. The water pump communicates with the pipe and is configured to circulate the refrigerant fluid in the liquid channel to remove heat from the circuit board assembly.
Claims13
A heat dissipation structure, applied to an electronic device, comprising:
- a circuit board assembly provided with a receiving chamber therein, an inlet, and an outlet, each of the inlet and the outlet communicating with the receiving chamber, wherein the circuit board assembly comprises a first circuit board, a second circuit board, and an interposer sandwiched between the first circuit board and the second circuit board, the interposer defines a through hole, and the first circuit board and the second circuit board cover ends of the through hole to form the receiving chamber, the interposer comprises a first surface in contact with the first circuit board and a second surface in contact with the second circuit board, the first surface is provided with a plurality of first solder pads, the second surface is provided with a plurality of second solder pads, the first circuit board is soldered to the plurality of first solder pads to electrically connect to the interposer, the second circuit board is soldered to the plurality of second solder pads to electrically connect to the interposer;
- a pipe communicating with the inlet and the outlet, the pipe and the receiving chamber together forming a liquid channel;
- a refrigerant fluid received in the liquid channel;
- and
- a water pump communicating with the pipe and configured to circulate the refrigerant fluid in the liquid channel.
An electronic device comprising:
- a housing;
- and
- a heat dissipation structure received in the housing and in contact with the housing, the heat dissipation structure comprising:
- a circuit board assembly provided with a receiving chamber therein, an inlet, and an outlet, each of the inlet and the outlet communicating with the receiving chamber, wherein the circuit board assembly comprises a first circuit board, a second circuit board, and an interposer sandwiched between the first circuit board and the second circuit board, the interposer defines a through hole, and the first circuit board and the second circuit board cover ends of the through hole to form the receiving chamber, the interposer comprises a first surface in contact with the first circuit board and a second surface in contact with the second circuit board, the first surface is provided with a plurality of first solder pads, the second surface is provided with a plurality of second solder pads, the first circuit board is soldered to the plurality of first solder pads to electrically connect to the interposer, the second circuit board is soldered to the plurality of second solder pads to electrically connect to the interposer,
- a pipe communicating with the inlet and the outlet, the pipe and the receiving chamber together forming a liquid channel,
- a refrigerant fluid received in the liquid channel, and
- a water pump communicating with the pipe and configured to circulate the refrigerant fluid in the liquid channel.
Dependencies are inferred from the claim text.