Camera module having a slim overall structure and portable device comprising same
AssigneeLG Innotek Co., Ltd.
InventorJae Keun Park
Life of this patent
Estimating the term…
Abstract
A camera module includes a lens driving device having a housing, a first circuit board disposed below the housing, a filter disposed on an upper surface of the first circuit board, a second circuit board disposed below the first circuit board, an image sensor disposed on the second circuit board and coupled to a lower surface of the first circuit board, and a first adhesive member disposed between the lower surface of the first circuit board and an upper surface of the second circuit board, and electrically connecting the first circuit board and the second circuit board. A lower surface of the image sensor is higher than the upper surface of the second circuit board.
Claims20
A camera module comprising:
- a lens driving device having a housing;
- a first circuit board disposed below the housing;
- a filter disposed on an upper surface of the first circuit board;
- a second circuit board disposed below the first circuit board;
- an image sensor disposed above the second circuit board and coupled to a lower surface of the first circuit board, the image sensor having an upper surface facing the filter and a lower surface opposite the upper surface;
- and
- a first adhesive member disposed between the lower surface of the first circuit board and an upper surface of the second circuit board, and electrically connecting the first circuit board and the second circuit board,
- wherein the lower surface of the image sensor is higher than the upper surface of the second circuit board.
A camera module comprising:
- a housing;
- a lens holder disposed in the housing;
- a first circuit board disposed below the lens holder;
- a filter disposed on an upper surface of the first circuit board;
- a second circuit board disposed below the first circuit board;
- an image sensor disposed above the second circuit board and coupled to a lower surface of the first circuit board;
- a first adhesive member disposed between the lower surface of the first circuit board and an upper surface of the second circuit board and electrically connecting the first circuit board and the second circuit board;
- and
- a conductive adhesive electrically connecting the image sensor and the first circuit board, wherein the first adhesive member is a solder ball,
- wherein a thickness of the first adhesive member in a direction perpendicular to the upper surface of the second circuit board is greater than a thickness of the image sensor in the direction perpendicular to the upper surface of the second circuit board, and
- wherein the conductive adhesive is overlapped with the image sensor in a first direction, and the first direction is a direction parallel to the upper surface of the second circuit board.
Dependencies are inferred from the claim text.