Module with high peak bandwidth I/O channels

A high peak bandwidth I/O channel embedded within a multilayer surface interface that forms the bus circuitry electrically interfacing the output or input port on a first semiconductor die with the input or output port on a second semiconductor die, wherein the high peak bandwidth I/O channel comprises:

• vias in electrical communication with the input and output ports on the first and second semiconductor die,
• a channel link comprising conductive means embedded within low permittivity/ultra-low loss dielectric that electrically interconnects the vias,
• a passive network filtering circuit comprising capacitive, inductive, and resistive elements embedded within the high peak bandwidth I/O channel,
• a multilayer surface interface comprising the channel link embedded within a data signal plane,
• additional conductive means to form power planes and ground planes, or optional signal control planes;
• wherein,
• the passive network filtering circuit comprises components including high energy density electroceramic dielectric that polarizes and depolarizes with femto-second response times.

A networked computing system including a telecommunications system that contains network nodes and manages the flow of data between and within server farms, wherein the hardware forming the telecommunications system, transceiver circuits within network nodes, and server farms comprise hybrid computing modules that comprise:

• semiconductor die that serve all functions needed to support networked computing, wherein,
• the semiconductor die are mounted on a substrate that forms an electrical interface between the semiconductor die in the hybrid computing module,
• and,
• the substrate comprises a multilayer surface interface that further comprises a high peak bandwidth I/O channel comprising:
• low permittivity/ultra-low loss dielectric;
• conductive means used to form ground planes, power planes, signal data planes and electrical interface between the ground planes, power planes, and signal data planes;
• wherein,
• the signal data planes further comprise high energy density electroceramic dielectric embedded within layers of low permittivity/ultra-low loss dielectric and photo-lithographically patterned to form passive circuit elements configured to function as a passive filtering network;
• and,
• wherein high energy density electroceramic dielectric forming capacitive passive circuit elements has a dielectric response that polarizes and de-polarizes on femto-second time scales and maintains physical dimension less than 1/20th of the guided wavelength of a system operating frequency in excess of 3 GHz.