High-frequency module and communication device
AssigneeMurata Manufacturing Co., Ltd.
InventorDai Nakagawa
Life of this patent
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Abstract
A high-frequency module (100) includes a multilayer board (110) including a plurality of insulator layers and at least one ground conductor layer (113); in the multilayer board (110), a transmission circuit (120) that is a first circuit provided in a first region and an antenna circuit (130) that is a second circuit provided in a second region different from the first region; and shielding conductor films (151 to 156) provided on sides of the multilayer board (110) and being partially in contact with the ground conductor layer (113). The ground conductor layer (113) is not in contact with the shielding conductor films (151 to 156) in, of a side of the multilayer board (110), a portion that is closest both to the first region and to the second region.
Claims13
A high-frequency module comprising:
- a multilayer board including a plurality of insulator layers and at least one ground conductor layer;
- a first circuit provided in a first region of the multilayer board;
- a second circuit provided in a second region of the multilayer board, wherein the second region is a region different from the first region;
- and
- a shielding conductor film provided on a side of the multilayer board and being partially in contact with the ground conductor layer,
- wherein the ground conductor layer is not in contact with the shielding conductor film in a portion of the side of the multilayer board closest both to the first region and to the second region.
Dependencies are inferred from the claim text.