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US 11,239,816 B1Granted
Decoupled transversely-excited film bulk acoustic resonators
AssigneeResonant Inc.
InventorSean McHugh
Life of this patent
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Abstract
Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate and a piezoelectric plate having parallel front and back surfaces, the back surface attached to the substrate. A decoupling dielectric layer is on the front surface of the piezoelectric plate. An interdigital transducer (IDT) is formed over the decoupling dielectric layer such that interleaved fingers of the IDT are over a portion of the piezoelectric plate suspended across a cavity formed in the substrate.
Claims20
An acoustic resonator device comprising:
- a substrate;
- a piezoelectric plate having front and back surfaces, a thickness between the front and back surfaces greater than or equal to 200 nm and less than or equal to 1000 nm, the back surface attached to the substrate;
- a decoupling dielectric layer on the front surface of the piezoelectric plate;
- and
- an interdigital transducer (IDT) formed on the decoupling dielectric layer such that interleaved fingers of the IDT are over a portion of the piezoelectric plate suspended across a cavity formed in the substrate.
2 more elements
A filter device, comprising:
- a substrate;
- a piezoelectric plate having front and back surfaces, a thickness between the front and back surfaces greater than or equal to 200 nm and less than or equal to 1000 nm, the back surface attached to the substrate;
- a decoupling dielectric layer on the front surface of the piezoelectric plate;
- and
- a conductor pattern formed on the decoupling dielectric layer, the conductor pattern including a plurality of interdigital transducers (IDTs) of a respective plurality of resonators, wherein
- interleaved fingers of each of the plurality of IDTs are over respective portions of the piezoelectric plate suspended across one or more cavities formed in the substrate.
3 more elements
A method of fabricating an acoustic resonator device, comprising:
- attaching a back surface of a piezoelectric plate to a substrate, the piezoelectric plate having a thickness greater than or equal to 200 nm and less than or equal to 1000 nm;
- forming a cavity in the substrate such that a portion of the piezoelectric plate is suspended across the cavity;
- forming a decoupling dielectric layer on a front surface of the piezoelectric plate;
- and
- forming an interdigital transducer (IDT) over the decoupling dielectric layer such that interleaved fingers of the IDT are over the portion of the piezoelectric plate suspended across the cavity.
2 more elements
Dependencies are inferred from the claim text.