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US 11,239,813 B2Granted
Resonant circuit element and circuit module
AssigneeMurata Manufacturing Co., Ltd.
InventorKiyomi Ikemoto
Life of this patent
Estimating the term…
Abstract
A first conductive pattern made from a conductive material is formed on a first surface that is one surface of a flexible film made from a dielectric material. An adhesive layer is disposed on a second surface opposite to the first surface of the flexible film. A pair of first outer electrodes generates an electric field in an in-plane direction of a composite member composed of the flexible film and the adhesive layer, and causes an electric current to flow through the first conductive pattern.
Claims10
A resonant circuit element comprising:
- a flexible film made from a dielectric material;
- a first conductive pattern made from a conductive material and formed on a first surface that is one surface of the flexible film;
- an adhesive layer disposed on a second surface opposite to the first surface of the flexible film;
- and
- a pair of first outer electrodes configured to generate an electric field in an in-plane direction of a composite member composed of the flexible film and the adhesive layer, and to cause an electric current to flow through the first conductive pattern, wherein
- the adhesive layer adheres the resonant circuit element to a mounting substrate on which the resonant circuit element is mounted, and
- the adhesive layer is formed on an outermost layer of the resonant circuit element.
4 more elements
A circuit module comprising:
- a printed circuit board provided with a plurality of conductive portions;
- and
- a resonant circuit element mounted on the printed circuit board and connecting two conductive portions of the plurality of conductive portions to each other, wherein
- the resonant circuit element includes
- a flexible film made from a dielectric material,
- a first conductive pattern made from a conductive material and formed on a first surface that is one surface of the flexible film,
- an adhesive layer disposed on a second surface opposite to the first surface of the flexible film, and
- a pair of outer electrodes configured to generate an electric field in an in-plane direction of a composite member composed of the flexible film and the adhesive layer, and to cause an electric current to flow through the first conductive pattern,
- each of the outer electrodes of the pair is electrically connected to a corresponding one of the two conductive portions, and the resonant circuit element is bonded to the printed circuit board via the adhesive layer,
- the adhesive layer adheres the resonant circuit element to the printed circuit board on which the resonant circuit element is mounted, and
- the adhesive layer is formed on an outermost layer of the resonant circuit element.
8 more elements
Dependencies are inferred from the claim text.